iNEMI Plans Substrate & Package Technology Workshop

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The International Electronics Manufacturing Initiative (iNEMI) will hold a workshop May 26 and 27 in Singapore to focus industry discussion on advanced and emerging substrate and package technologies. The event will be hosted by iNEMI member IBM at their Singapore location.

With new technologies such as IoT devices and wearable electronics, there is an increasing need for smaller form factors, lower power consumption, and flexible designs. The demands of these new devices have led to major changes in architecture, materials and manufacturing processes, and the question of how to package these new devices has become critical. As a result, the pace of change in packaging technology is at its highest rate in history, and these changes have led to the emergence of new packaging technologies such as system-in-package (SiP), wafer-level packaging, and embedded packages.

This iNEMI workshop will bring together supply chain leaders to share information about some of the latest assembly and packaging technologies and how they will enable next-generation devices. Discussions will not only cover the latest developments in materials, equipment, assembly processes and package systems, but also assess current capabilities and identify any critical gaps in technology. The agenda includes speakers from:

• ASE
• ASM
• Hitachi Chemical
• IBM
• IME
• Intel
• Kyocera
• NXP
• Shinko
• STATS ChipPAC
• Yole Development

About iNEMI

The International Electronics Manufacturing Initiative's mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. This industry-led consortium is made up of approximately 90 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan.