Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Henger to Showcase AI‑Era Plasma Solutions at APEX EXPO 2026

03/11/2026 | Henger
Henger will be exhibiting at APEX EXPO 2026 to present its latest plasma treatment solutions designed for the AI‑driven generation of high‑speed, high‑density PCB manufacturing.

Chemcut at APEX EXPO 2026: Innovations & Opportunities

03/11/2026 | Chemcut Corporation
Next week, Chemcut will be exhibiting at APEX EXPO, taking place March 17–19, 2026 at the Anaheim Convention Center in Anaheim, California.

Introducing Octopart Discover: From Part Search to Solutions Discovery

03/11/2026 | Altium
Octopart, an Altium company, introduced Octopart Discover, the next evolution of Octopart that brings design intent and persistent system context into solutions discovery — moving engineers beyond part search to discovering and evaluating system-fit solutions. Octopart Discover will be showcased at Booth 3A-415 during embedded world.

UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging

03/11/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.

SMTA WLPS 2026 Review: Shifting Microelectronic Package Development

03/11/2026 | Vern Solberg, Consultant
The Surface Mount Technology Association (SMTA) hosts a number of timely events each year to focus on key technologies. The most recent, the 2026 Wafer-Level Packaging Symposium, held in San Francisco this February, brought together prominent technologists and manufacturers involved in microelectronic package development and related infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in