-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel Webinar 'Reliable 3D Measurement of Solder Paste and Sinter Paste' Now Available On Demand
May 31, 2016 | GOEPEL ElectronicEstimated reading time: 1 minute
Global provider of innovative electronic and optical test and inspection systems Goepel is pleased to announce their latest webinar, “The most important facts about reliable 3D measurement of solder paste and sinter paste” is now available On Demand.
This free presentation (beginner to advanced users) addresses detection of solder and sinter paste defects and will be ideally suited for quality and production managers for electronic assemblies, technologists and production planners as well as CEOs and directors of electronics manufacturing companies.
Faults in PCB manufacturing may occur at different places within the production line, but approximately 60% of them are caused by solder paste defects. Since printing is at the beginning of the assembly line, faults found there are less cost-intensive. Detecting such faults early in the operation at the printing step allows them to be addressed in the most cost effectively way possible.
What technologies exist for effective inspection of solder paste and sinter paste? What are the requirements for sinter paste inspection compared with solder paste inspection? What does process optimization through Closed Loop look like? How can cross-linking between different inspection systems be realized in the frame of industry 4.0? Speaker David Whetstone, GOEPEL electronics LLC, answers these questions and more during this webinar.
Visit Goepel’s “The most important facts about reliable 3D measurement of solder paste and sinter paste” event page to view the webinar for free today.
About GOEPEL electronic
GOEPEL electronic is a worldwide leading vendor of innovative electronic and optical test and inspection systems, being the market leader for professional JTAG/Boundary Scan solutions for Embedded System Access (ESA). A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of system installations worldwide. Founded in 1991 and headquartered in Jena/Germany, GOEPEL electronic employs currently more than 230 employees and generated a revenue of 30 Million Euro in 2015. GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronic’s products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found here.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.