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PNC Improves Manufacturing Capabilities with Ersa Selective Wave Solder
May 31, 2016 | PNCEstimated reading time: 1 minute
PNC Inc. has improved its manufacturing capabilities with the recent purchase of an ECOSELECT 2 selective wave solder machine manufactured by Ersa.
In today's advancing technological climate, boards are more frequently being designed with a high concentration of mixed technologies. A selective wave solder machine has many advantages over a traditional wave soldering machine which made this an appropriate investment for PNC to make.
Not only is a selective solder cleaner in terms of less flux residue being left on the board's surface, it is also more economical due to the reduced amount of flux used. Instead of passing over a wave of molten solder introducing the board to another heat cycle, these machines have nozzles that are programmed to only put solder where needed. As a result, the flux that precedes the solder is also only placed where needed, which in turn leads to a cleaner board. Once programmed, a selective wave solder can cut down on hours of manual through-hole soldering.
"The acquisition of the Ersa ECOSELECT 2 Selective Wave Solder is in keeping with our philosophy of providing the best quality under the Total Concept model while still maintaining some semblance of cost efficiency. By adopting the Total Concept, we have been able to provide our customers with a full suite of quality printed circuit board solutions under one roof," said President and CEO Sam Sangani.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.