Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/02/2025 | Marcy LaRont, PCB007 Magazine
In our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.

Indium Wins EM Asia Innovation Award

05/01/2025 | Indium Corporation
Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.

Elephantech, Logitech Together Drive Disruptive Electronics Innovation

05/01/2025 | Elephantech
Elephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.

SEL Receives Purdue Senior Design Partner of the Year Award

05/01/2025 | Schweitzer Engineering Laboratories
Schweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.

Discover the Future of AI in Test and Inspection in the May 2025 Issue of SMT007 Magazine

05/01/2025 | I-Connect007 Editorial Team
Are you ready to explore the cutting-edge advancements in AI shaping the electronics manufacturing industry through test and inspection? The May 2025 issue of SMT007 Magazine provides insights, innovations, and perspectives from today's top experts you won't find anywhere else.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in