Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Alpha Assembly Solutions to Present PV Product Technologies at Intersolar Europe
June 2, 2016 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the development of non-hazardous solder and electronic assembly materials for photovoltaic manufacturing and assembly, plans to showcase their vast product offering at the Intersolar Europe show taking place June 22 – 24 in Munich, Germany.
As the installation of solar panels continues to expand and early modules begin to be replaced, the industry is estimating growing volumes of PV waste.
“Switching over to and incorporating non-hazardous, environmentally friendly manufacturing materials, such as lead-free soldering materials, in conjunction with and in advance of various legislative directives, will be more cost effective for manufacturers,” said Mike Murphy, Senior Global Product Manager, Solid Solder Alloys and PV Interconnect Materials. “This will also add incentive for expanding solar installations and be a better long-term strategy to ensure the environment is not harmed when these materials are disposed.”
During the exhibition, Alpha will also be featuring its vast PV product portfolio:
- ALPHA Sn/Pb & Pb-Free Solder Alloys
- ALPHA Liquid Soldering Fluxes for PV Tabbing & Stringing Applications
- ALPHA Telecore XL-825 Cored Solder Wire
- ALPHA PV Solder Paste
- ALPHA PV-Ready Exactalloy® Preforms
In addition, Narahari S. Pujari, Manager of New Business Development, will be participating in Poster Session (#5BV.1.38) entitled “Compatibility of PV Ribbons and Fluxes with EVA Encapsulant Films.”
To learn more about Alpha Assembly Solutions, please visit us at the Intersolar Europe show at booth #A2.138 and ask about our new photovoltaic product technologies.
Additional information:
Intersolar Europe
Exhibition: June 22 - 24, 2016
Conference: June 21 – 22, 2016
Messe München, Germany
About Intersolar Europe
Intersolar Europe takes place annually at Messe München. It is the world’s leading exhibition for the solar industry and its partners. In 2015, more than 1,000 international exhibitors and around 38,000 trade visitors attended Intersolar Europe. The exhibition focuses on the areas of photovoltaics, PV production technologies, energy storage systems and renewable heating. Since its founding, it has become the most important industry platform for manufacturers, suppliers, distributors, service providers and partners of the solar industry. The accompanying Intersolar Europe Conference consolidates the topics of the exhibition.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.