-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
New SMT Coin Cell Contacts for Battery Enclosures
June 7, 2016 | Keystone Electronics Corp.Estimated reading time: 1 minute

Keystone Electronics has recently introduced additional contacts into its diverse selection of SMT enclosure coin cell contacts providing more design versatility for cost effective, dependable connections in self-contained battery compartments.
These new contacts require minimal board space while allowing easy installation and removal of a coin cell battery within a battery enclosure. Their ultra low profile and compact design makes these contacts ideal for small hand held controls, key fobs, personal medical devices, digital timers, and many other industrial and consumer applications. Manufactured from gold plated stainless steel, these new contacts offer low contact resistance ensuring easy reflow soldering for reliable solder joints. The spring tension adjusts to all cell height variations for dependable connectivity of coin cells with diameters from 12mm and larger with heights from 1.2mm to 7.7mm.
Positive and Negative battery contacts are available in the series. For Positive contact use with 12mm to 23mm coin cells select Catalog #120 (120TR on tape and reel); 16mm to 30mm coin cells select Catalog #110 (110TR); 20mm to 24mm coin cells choose Catalog #122 (122TR). The matching Negative contacts are also available: for 12mm to 16mm coin cells select Catalog #118 (118TR on tape and reel); 16mm to 30mm coin cells select Catalog #112 (112TR). Tape and reel (TR part numbers) are ideal for use with most vacuum and mechanical pick-and-place assembly systems.
The company’s full line of battery hardware also consists of SMT and THM products including contacts, clips, holders, retainers and straps in assorted materials for coin cells and batteries. In addition to a comprehensive line of interconnect hardware and components, Keystone provides application engineering services for product modification and special design requirements, supported by pro-active stamping, machining and assembly operations.
Keystone is ISO-9001:2008 certified, RoHS compliant, with US headquarters and offices in Canada, Europe, Australia and Asia. For more information contact Keystone Electronics Corp.at: www.keyelco.com
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.