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The Chemical Connection: Common Misconceptions in Wet Processing

04/28/2025 | Don Ball -- Column: The Chemical Connection
Initially, I thought an April Fool’s column would be fun this month. I could highlight some of the crazier ideas and misconceptions I’ve witnessed over the years from potential customers and we could all have a good laugh. For example, there was a first-time buyer of a ferric chloride etcher (with no regeneration system) who was astonished to learn that he had to put fresh etchant in the system occasionally to maintain production.

Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley

04/17/2025 | PRNewswire
Lam Research Corp. announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.

Chemcut Corporation Announces Atlantic Micro Tool Expanded Sales Territory

03/11/2025 | Chemcut Corporation
Chemcut Corporation, the US based manufacturer of Wet Process Equipment, has expanded Atlantic Micro Tools sales territory to include DE, MD, VA, WV, NY, PA, NC, SC, TN, GA, AL, FL, MS, Ontario. Atlantic Micro Tool has represented Chemcut for over 15 years in the States of ME, NH, VT, RI, CT, NJ, New York City MA, NY counties of Nassau, Suffolk, Quebec & Eastern Ontario.

TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips

01/24/2025 | SCHMID Group
TRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.

Connect the Dots: Designing for Reality: Strip-Etch-Strip

12/05/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.
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