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Shenmao America to Showcase BGA, Micro BGA Solder Spheres at SEMICON WEST
June 30, 2016 | SHENMAO America Inc.Estimated reading time: Less than a minute
Shenmao America Inc. will be introducing its BGA and Micro BGA Solder Spheres at the upcoming SEMICON West event happening from July 12–14, 2016 at the Moscone Center in San Francisco, California.
Shenmao’s BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and flip chip assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact alloy compositions using piezoelectric droplet jet technology. The solder spheres feature accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. They are available in various diameters: 0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.
Shenmao will also be showcasing its High Drop-Resistance Alloy PF902-S (SAC0307X), which greatly increases reliability and performance of portable electronic devices drop test.
Shenmao will be at Booth 6467.
For more information, please contact: Shenmao America Inc. (www.shenmao.com) at 408-943-1755 or e-mail: usa@shenmao.com.
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