-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Everett Charles Technologies Launches LFRE-39 Probe
July 5, 2016 | Everett Charles TechnologiesEstimated reading time: 2 minutes
Everett Charles Technologies (ECT) has expanded its comprehensive portfolio of products for lead-free test applications with the launch of the LFRE-39 spring probe. LFRE-39 features ECT's LFRE plating and is designed to meet fine pitch requirements down to 39 mil (1.0 mm). The LFRE-39 fully meets the demanding requirements of high volume production in-circuit and functional test.
LFRE plated probes are field proven to provide enhanced performance in high volume production test environments. LFRE probes are less prone to solder transfer and tip wear due to their exceptional hardness. Lead free solder and OSP (Organic Solderability Preservatives) treated copper pads typically present a harder or more abrasive contact surface causing excessive plating and probe tip wear. Customers report that LFRE plating has demonstrated longer life and MTBM (mean time between maintenance) on their most challenging applications. LFRE plating is significantly harder than typical gold plating. LFRE has a hardness range of 550 to 650 Knoop which is about 3 to 4 times harder than standard gold. This makes the probe tips more durable and less susceptible to solder and material transfer. LFRE plated probes are the best solution to contact RoHS compliant boards and OSP boards.
Lead free plating is featured on ECT’s industry standard PogoPlus® LFRE series, Metrix™, and on LFLT Long Travel probes. With the addition of LFRE-39, ECT’s proprietary plating is now available on a wide range of pitch options.
Tony DeRosa, Product Manager, explains: “In head to head testing with traditional gold plated probes, LFRE plated probes offer lower and more consistent resistance. LFRE probes have also outperformed gold plated probes in high volume production test applications by 3 to 5% first pass yield improvement. With LFRE-39 we can provide a reliable test probe solution for fine pitch lead-free PCBA test fixture applications.”
About Everett Charles Technologies (ECT)
ECT (headquartered in Fontana, CA) is the world's leading manufacturer of POGO ® contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards. R&D programs address engineering and materials issues that will affect Contact Solutions for the next decade. Methods for maintaining electrical continuity in miniature probes, improved spring technologies, and probe head geometries are under continual review. ECT POGO ® contacts are marketed worldwide through sales offices in the United States, Europe and Asia. ECT is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.