-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Nano Dimension Achieves Important Milestone in 3d-Printed Circuit Boards
July 5, 2016 | Nano DimensionEstimated reading time: 2 minutes
Nano Dimension Ltd., a leader in the field of 3D Printed Electronics, announced today that it has completed the development of the initial version of its software package, which will be integrated in the company's DragonFly 2020 3D printer. The company’s Dragonfly 3D printer, which is currently in development, will use proprietary inks and integrated software to quickly create fully functioning printed circuit board (PCB) prototypes.
The software package, called ‘Switch’, enables preparation of production files of printed electronic circuits using the DragonFly 2020 3D printer. The software supports customary formats in the electronics industry such as Gerber files, as well as VIA and DRILL files.
The ’Switch’ software presents a unique interface that displays Gerber files and an accurate and detailed description of the PCB's structure, which facilitates a highly precise conversion to a 3D file format.
By using the software, the user of the DragonFly 2020 3D printer will be able edit and prepare multilayer 3D files for printing. Many parameters can be adjusted, such as layer thickness, conductor width, layer order, punching and rotation options as well as the shape or object outline. In addition, the software enables an optimization of the printing process by maximizing the use of the printing surface.
Amit Dror, CEO of Nano Dimension, noted: "We are thrilled to announce the completion of the development of the initial version of our 3D printer software which presents a new dimension for creating and designing electronic circuits. In order to minimize production time, Nano Dimension strives to provide its customers a comprehensive solution to 3D print multilayer PCB prototypes: our novel 3D printer, advanced conductive and dielectric nano-inks, and now – an advanced software package for the management, editing and printing of electronics files. The software is designed to allow the engineer to create the production files for automat 3D printing, with no intermediate files. It’s now easy to ‘Switch’ from Gerber to 3D files."
About Nano Dimension Ltd.
Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems and advanced additive manufacturing. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.
In addition to the trading of the company's American Depositary Shares on NASDAQ, the company's ordinary shares are also traded on the TASE in Israel. The Bank of New York Mellon serves as the depositary for Nano Dimension.
Suggested Items
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Flexible Thinking: Flexible Circuit Technology—Looking Back and Forward
03/03/2025 | Joe Fjelstad -- Column: Flexible ThinkingFlexible circuit technology came on the scene as a solution largely for niche applications, however, the technology has emerged in recent years as a cornerstone of modern electronics. Today, the technology is enabling a broad range of new product designs across industries. From wearable devices and medical implants to foldable smartphones and numerous automotive applications, flexible circuits are arguably at the heart of much of the next generation of innovations.