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Alpha's Mitch Holtzer to Present on Ionic Contamination and SIR Testing at SMTA Ohio Expo & Tech Forum
July 6, 2016 | Alpha Assembly SolutionsEstimated reading time: 3 minutes
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming SMTA Ohio Expo & Tech Forum on August 4 in Cleveland, Ohio as both an exhibitor and technical presenter.
A presentation on The Discrepancy Between Ionic Contamination and SIR Testing in Predicting Electrical Reliability will be given by Mitch Holtzer, Global Director of Customer Technical Support for Alpha Assembly Solutions. Among the topics covered, Holtzer will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
“Many users of no-clean solder pastes treat ROSE (Resistance of Solvent Extract) testing as suitable to ascertain whether or not flux residues will be detrimental to the long-term reliability of printed circuit assemblies”, said Mitch Holtzer. “However, when compared to SIR (Surface Insulation Resistance) testing, the results of ROSE tests can be shown to provide different results than SIR on the same materials.”
In addition, Alpha’s exhibit will showcase their innovative materials and solutions for the electronics assembly industry with particular focus on ALPHA® Solder Paste & Preforms for Optimized Process Solutions and ALPHA® Wave Solder Alloy & Chemistries and Cored Solder Wire for Optimal Performance.
More information on Alpha’s unique process technology can be found on their website.
Additional information:
August 4, 2016
Embassy Suites Cleveland Rockside
5800 Rockside Woods Boulevard
Independence (Cleveland), OH 44131
Exhibit Hours: 10:00AM – 3:00PM
The Discrepancy Between Ionic Contamination and SIR Testing in Predicting Electrical Reliability
Presented by: Mitch Holtzer – ALPHA ASSEMBLY SOLUTIONS
Speaker Biography – Mitch Holtzer
As the Global Director of Customer Technical Support (CTS) for Alpha, Mitch sets direction and provides coordination for the Alpha CTS group in a global capacity. A major focus of this position is to provide strategic support to OEM, CEM and Automotive customers and target accounts. Mitch joined Alpha in 1998 and has progressed through positions of increasing responsibilities in Marketing, Product Management and R&D. He is a graduate of Purdue University with a degree in Chemistry and holds an MBA from Temple University.
About SMTA The Surface
Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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