-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA International Keynote Presenters Unveiled
July 14, 2016 | SMTAEstimated reading time: 1 minute
The Surface Mount Technology Association (SMTA) has unveiled the keynote presenters for the upcoming SMTA International 2016 conference, which will be held from September 25–29, 2016 at the Donald E. Stephens Convention Center in Rosemont, Illinois.
Daniel Kuhl of Seagate Technology will present “How is Your Storage?” for the SMTAI keynote address on September 27. He will talk about the BIG memory storage explosion and factors influencing global design and architecture, technology progression and infrastructure for manufacturing and validation.
At the Harsh Environments Keynote, Dwight Howard of Delphi will present “Advances in Autonomous Driving and V2X Technologies”. His presentation will highlight several key aspects of advancements in automotive technologies and systems, including complex system elements, integration and cognitive computing required for these systems to achieve operational capability; current state of the supporting subsystems and overall vehicle systems required to make these capabilities possible; few of the key lessons-learned from a ground-breaking, first-ever, trans-USA drive experiment conducted in 2015; and an outlook of the practical deployment of these advances into daily usage.
Intel Corp.’s Milena Vujosevic, PhD, will present on “Certification for the Future: Meeting Challenges of New Packaging Technologies in Rapidly Evolving Markets” at the Women's Leadership Program keynote. This presentation discusses a novel approach to the definition of requirements for package certifications. The developed methodology challenges the existing industry practices that are a basis of the industry certification standards. This new methodology leverages the knowledge of use conditions and fundamental physics, and couples it with advanced computational mechanics modeling. The special focus is on the essential role of the physics based damage metrics in scaling from use condition to test conditions and in design for reliability. This Knowledge-based Qualification methodology is discussed relative to Standards-Based Qualifications showing that Knowledge-Based Qualification provides a superior technical framework for enabling future packaging technologies and customer designs.
For more information, click here.
Suggested Items
KYZEN’s Adam Klett to Keynote at SMTA Electronics in Harsh Environments Conference
05/07/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced today that KYZEN’s Director of Science, Adam Klett, PhD will present as a keynote speaker at the SMTA Electronics in Harsh Environments Conference. The event is scheduled to take place May 14-16, 2024 at the Technical University of Denmark in Copenhagen, Denmark.
SMTA Long Island Chapter Celebrates 30th Anniversary with Membership Appreciation Event
04/25/2024 | SMTAThe Surface Mount Technology Association (SMTA) Long Island Chapter is thrilled to announce its 30th Anniversary and Membership Appreciation Event on Wednesday, May 15th, 2024, from 5:30 to 8:30 p.m. EST. The event will take place at Top Golf Long Island-Holtsville, promising an evening of camaraderie, celebration and fun-filled activities.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
SMTA Announces Program for High Reliability: Strategic Technology Advancement Research Forum
04/08/2024 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 2, 2024 in Olathe, Kansas, USA. The event, now in its second year, addresses challenges for electronics manufacturers in the high reliability sector.
SMTA Conducts First UHDI Symposium
03/29/2024 | Marcy LaRont, PCB007 MagazineSMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.