The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
KYZEN to Reveal New Research Findings at NEPCON South China
July 26, 2016 | KyzenEstimated reading time: 1 minute
KYZEN announced plans to reveal new research findings in Stand 1P01 at NEPCON South China, scheduled to take place Aug. 30- Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared during the event.
The evidence from this lengthy and objective study includes process videos and strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition. It concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as CYBERSOLV® C8882 than they are with standard IPA. In addition to sharing the results of the stencil reliability research findings, visitors to the KYZEN booth can acquire custom technical support to help reduce misprints and increase production yields at no cost.
CYBERSOLV® C8882 is a state-of-the-art IPA alternative for stencil cleaning. A fast-acting stencil cleaning solvent, C8882 is designed for the understencil wipe and hand cleaning processes. C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin, and low residue no-clean fluxes.
KYZEN also will feature its award-winning aqueous products, such as LONOX L5611 and AQUANOXA4625B.
With more than 25 years of experience and more than 50 industry awards, KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.