-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
KYZEN to Reveal New Research Findings at NEPCON South China
July 26, 2016 | KyzenEstimated reading time: 1 minute

KYZEN announced plans to reveal new research findings in Stand 1P01 at NEPCON South China, scheduled to take place Aug. 30- Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared during the event.
The evidence from this lengthy and objective study includes process videos and strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition. It concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as CYBERSOLV® C8882 than they are with standard IPA. In addition to sharing the results of the stencil reliability research findings, visitors to the KYZEN booth can acquire custom technical support to help reduce misprints and increase production yields at no cost.
CYBERSOLV® C8882 is a state-of-the-art IPA alternative for stencil cleaning. A fast-acting stencil cleaning solvent, C8882 is designed for the understencil wipe and hand cleaning processes. C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin, and low residue no-clean fluxes.
KYZEN also will feature its award-winning aqueous products, such as LONOX L5611 and AQUANOXA4625B.
With more than 25 years of experience and more than 50 industry awards, KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.
Elmotec by E-Tronix to Showcase SolderSmart® TOP Robotic Soldering at The Assembly Show 2025
10/06/2025 | ELMOTECE-tronix, a Stromberg Company, is pleased to announce its participation at The Assembly Show 2025 in Rosemont, IL, October 21st through 23rd. Exhibiting under Elmotec by E-Tronix, Booth #448, the team will highlight the SolderSmart® TOP robotic soldering system, featuring live demonstrations throughout the show.