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Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.

Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering

11/13/2024 | Rehm Thermal Systems
Rehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.

Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens

10/14/2024 | Bransys
Bransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.

Real Time with... SMTA Guadalajara 2024: Rehm Celebrates 10 Years and New Beginnings in Mexico

09/25/2024 | Real Time with... SMTA Guadalajara
Nolan Johnson interviews Luis Garcia, General Manager for Rehm's Mexico division. Celebrating Rehm's 10 years in Mexico, Garcia discusses the company's journey from their US operations to establishing their Mexican office.

Successful Rehm Technology Days 2024 – Where the Future Meets Technology

09/17/2024 | Rehm Thermal Systems
Traditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
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