The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Rehm to Exhibit at NEPCON South China
August 1, 2016 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems will be showcasing its new equipment for reflow convection and condensation soldering processes at the upcoming NEPCON South China trade show, which will be held in Shenzhen, China, from August 30 to September 1, 2016.
Rehm will present the following systems at its booth (1N60) at the trade fair:
VisionXP+ Vac – The two-in-one solution for reflow convection soldering
The VisionXP+ convection soldering system brings together numerous further developments, primarily with a view to optimising energy efficiency and reducing emissions. The system enables customers to make an energy saving of up to 20 % in electronics production and generate an average of 10 tonnes less CO2 a year. The vacuum option makes convection soldering processes possible with or without a vacuum for the first time ever – in a single system! The VisionXP+ Vac reliably removes gas inclusions and voids during the convection soldering process while the solder is still in an ideally molten state. With a negative pressure of up to 2 mbar, void rates of below 2 % are possible.
CondensoXM – Condensation soldering with or without a vacuum
In reflow condensation soldering with the CondensoXM, the soldering process is carried out with the aid of a hot vapour and the heat transfer medium Galden®. As heat transfer in condensation soldering is as much as ten times higher than in convection soldering, large or high-mass boards can be processed without any problems. The use of the injection principle and the control of temperature and pressure ensure precise and varied reflow profiling. The system is based on a sophisticated design, particularly with respect to the hermetically sealed process chamber. Since the boards are not moved during the process, vacuum profiling and temperature profiling are optimally combined in a single system. The CondensoXM is equipped with an extended conveyor axis and can thus be flexibly integrated into the existing workflow.
About Rehm Thermal Systems
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.