-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Rehm to Exhibit at NEPCON South China
August 1, 2016 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems will be showcasing its new equipment for reflow convection and condensation soldering processes at the upcoming NEPCON South China trade show, which will be held in Shenzhen, China, from August 30 to September 1, 2016.
Rehm will present the following systems at its booth (1N60) at the trade fair:
VisionXP+ Vac – The two-in-one solution for reflow convection soldering
The VisionXP+ convection soldering system brings together numerous further developments, primarily with a view to optimising energy efficiency and reducing emissions. The system enables customers to make an energy saving of up to 20 % in electronics production and generate an average of 10 tonnes less CO2 a year. The vacuum option makes convection soldering processes possible with or without a vacuum for the first time ever – in a single system! The VisionXP+ Vac reliably removes gas inclusions and voids during the convection soldering process while the solder is still in an ideally molten state. With a negative pressure of up to 2 mbar, void rates of below 2 % are possible.
CondensoXM – Condensation soldering with or without a vacuum
In reflow condensation soldering with the CondensoXM, the soldering process is carried out with the aid of a hot vapour and the heat transfer medium Galden®. As heat transfer in condensation soldering is as much as ten times higher than in convection soldering, large or high-mass boards can be processed without any problems. The use of the injection principle and the control of temperature and pressure ensure precise and varied reflow profiling. The system is based on a sophisticated design, particularly with respect to the hermetically sealed process chamber. Since the boards are not moved during the process, vacuum profiling and temperature profiling are optimally combined in a single system. The CondensoXM is equipped with an extended conveyor axis and can thus be flexibly integrated into the existing workflow.
About Rehm Thermal Systems
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.