-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm to Exhibit at NEPCON South China
August 1, 2016 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems will be showcasing its new equipment for reflow convection and condensation soldering processes at the upcoming NEPCON South China trade show, which will be held in Shenzhen, China, from August 30 to September 1, 2016.
Rehm will present the following systems at its booth (1N60) at the trade fair:
VisionXP+ Vac – The two-in-one solution for reflow convection soldering
The VisionXP+ convection soldering system brings together numerous further developments, primarily with a view to optimising energy efficiency and reducing emissions. The system enables customers to make an energy saving of up to 20 % in electronics production and generate an average of 10 tonnes less CO2 a year. The vacuum option makes convection soldering processes possible with or without a vacuum for the first time ever – in a single system! The VisionXP+ Vac reliably removes gas inclusions and voids during the convection soldering process while the solder is still in an ideally molten state. With a negative pressure of up to 2 mbar, void rates of below 2 % are possible.
CondensoXM – Condensation soldering with or without a vacuum
In reflow condensation soldering with the CondensoXM, the soldering process is carried out with the aid of a hot vapour and the heat transfer medium Galden®. As heat transfer in condensation soldering is as much as ten times higher than in convection soldering, large or high-mass boards can be processed without any problems. The use of the injection principle and the control of temperature and pressure ensure precise and varied reflow profiling. The system is based on a sophisticated design, particularly with respect to the hermetically sealed process chamber. Since the boards are not moved during the process, vacuum profiling and temperature profiling are optimally combined in a single system. The CondensoXM is equipped with an extended conveyor axis and can thus be flexibly integrated into the existing workflow.
About Rehm Thermal Systems
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.