-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Happy’s Essential Skills: Benchmarking
August 3, 2016 | Happy HoldenEstimated reading time: 5 minutes
Editor's Note: Happy's columns will be published every Wednesday for the next two months.
Benchmarking is a process that measures how a company is performing against those industry leaders. It is used to better understand how outstanding companies perform, and then helps your company develop plans to improve or adapt specific best practices. Benchmarking is used to measure performance using a specific indicator (cost per unit of measure, productivity per unit of measure, cycle time of x per unit of measure or defects per unit of measure) resulting in a metric of performance that is then compared to others. A subset of benchmarking is the activity of ‘teardown.’ Many universities, as a few companies do this for profit. The most known is Portelligent[1]. David Carey, president of Portelligent. The Austin, Texas company produces teardown reports and related industry research on wireless, mobile and personal electronics and writes teardown articles for EETimes magazine. An example is seen in Figure 1.
Figure 1: Teardown benchmarking performed by Portelligent[1].
At HP, benchmarking was a very serious activity. All product lines conducted benchmarking on competitors’ products. For instruments, this was a lot easier than for a complex computer system. But in all cases, the detailed process was the same:
- Document all benchmarking activities by narrated video, high resolution camera, X-ray and microscopes
- Benchmark advertised performance using industry standards. Discover the maximum or minimum performance metrics
- Benchmark physical parameters: size, energy usage, heat produced, etc.
- Benchmark electrical parameters: power supply, number of PCBs, special electrical devices, etc.
- Benchmark the product disassembly and calculate the D&B DFM/A metrics
- Benchmark each PCB assembly: solder type, conformal coatings, heat sinks, number of parts, different part types, ICT
- Benchmark each printed circuit board: size, layers, design rules, wiring efficiency, special features-distributed capacitance
- Benchmark custom integrated circuits from each PCB, including silicon type, number of gates, design rules, etc.
- Collect all the benchmarking metrics, photos, videos and analysis into a multi-volume report from each HP organization
HP was very humble about benchmarking. It was always looking for better ideas, or exceptional performance and putting to work what it learned. Most of the time, HP exceeded other competitors’ performance, but it wanted to know how close the competitors were coming.
Benchmarking Process
The management use of the term is related to both of these, and a working definition is “the search for industry best practices that lead to superior performance.” Benchmarking is a process that aims to change operations in a structured way to achieve superior performance, based on an understanding of a company’s performance and how it compares with the best in the world. The basic philosophical steps of benchmarking, which are fundamental to success, are:
Know your operation—you need to assess the strengths and weaknesses of the internal operation, keeping in mind that competitors will in turn be analyzing your operation, and that if you don’t know your own strengths and weaknesses you will not be able to defend yourself. You need to know your strong points, to be able to promote them in the market place, and to identify areas that require strengthening.
Know the industry leaders or competitors—this helps you both to compare yourself with industry best practices and also to differentiate you from the competition.
Incorporate the best—learn from the companies who are leaders in your industry or who are particularly good in functions that are important to your operation. For example, you should compare your distribution operation with the best available mail order or service company.
Gain superiority—install the best of the best practices found, capitalize on your existing strengths and bring your weaknesses up to strength.
Benchmarking is the formalized and disciplined application of these basic steps to improving operations, as described in Figure 2. Table 1 shows some of the key reasons for benchmarking. The contrasting approaches ‘with benchmarking’ and ‘without benchmarking’ are detailed.
Figure 2: Benchmarking process steps.
Table 1: Some of the key reasons for benchmarking and the contrasting approaches with and without a benchmarking view.
Page 1 of 2
Suggested Items
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.