The Fearless Connector: Why I Chose the Hard Road
The Clean Truth: The Clean Truth About No-Clean Flux
Global Sourcing Spotlight: Beyond China Plus One—Building a Truly Global Supply Network
The SMTA Capital Chapter will be holding its Capital Expo and Tech Forum at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland 20723, on August 30.
During this year's expo, the Capital Chapter will host technical presentations by re:3D, Kyzen Corporation, Nokia, and MET Stencil. Specific topics include "How 3D Printing Hardware and New Materials are Changing the Face of Manufacturing," "Video Analysis of Solder Paste Release From Stencils," "Implementation of a Collaborative Industrial Consortia Program to Characterize the Thermal Fatigue Reliability of 3rd Generation Pb-Free Solder Alloys," and "An Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios."
Registration includes a complimentary lunch on the show floor as well as the opportunity to win numerous door prizes. Registration opens at 8:00 AM and the first technical presentation will start at 9:00 AM. Exhibits are open from 9:00 AM until 3:00 PM.
To register online to attend or exhibit, visit http://www.smta.org/expos/#capital.
