Quantum computers are largely hypothetical devices that could perform some calculations much more rapidly than conventional computers can. Instead of the bits of classical computation, which can represent 0 or 1, quantum computers consist of quantum bits, or qubits, which can, in some sense, represent 0 and 1 simultaneously.
Although quantum systems with as many as 12 qubits have been demonstrated in the lab, building quantum computers complex enough to perform useful computations will require miniaturizing qubit technology, much the way the miniaturization of transistors enabled modern computers.
Trapped ions are probably the most widely studied qubit technology, but they’ve historically required a large and complex hardware apparatus. In today’s Nature Nanotechnology, researchers from MIT and MIT Lincoln Laboratory report an important step toward practical quantum computers, with a paper describing a prototype chip that can trap ions in an electric field and, with built-in optics, direct laser light toward each of them.
“If you look at the traditional assembly, it’s a barrel that has a vacuum inside it, and inside that is this cage that’s trapping the ions. Then there’s basically an entire laboratory of external optics that are guiding the laser beams to the assembly of ions,” says Rajeev Ram, an MIT professor of electrical engineering and one of the senior authors on the paper. “Our vision is to take that external laboratory and miniaturize much of it onto a chip.”
Caged in
The Quantum Information and Integrated Nanosystems group at Lincoln Laboratory was one of several research groups already working to develop simpler, smaller ion traps known as surface traps. A standard ion trap looks like a tiny cage, whose bars are electrodes that produce an electric field. Ions line up in the center of the cage, parallel to the bars. A surface trap, by contrast, is a chip with electrodes embedded in its surface. The ions hover 50 micrometers above the electrodes.
Cage traps are intrinsically limited in size, but surface traps could, in principle, be extended indefinitely. With current technology, they would still have to be held in a vacuum chamber, but they would allow many more qubits to be crammed inside.
“We believe that surface traps are a key technology to enable these systems to scale to the very large number of ions that will be required for large-scale quantum computing,” says Jeremy Sage, who together with John Chiaverini leads Lincoln Laboratory’s trapped-ion quantum-information-processing project. “These cage traps work very well, but they really only work for maybe 10 to 20 ions, and they basically max out around there.”
Performing a quantum computation, however, requires precisely controlling the energy state of every qubit independently, and trapped-ion qubits are controlled with laser beams. In a surface trap, the ions are only about 5 micrometers apart. Hitting a single ion with an external laser, without affecting its neighbors, is incredibly difficult; only a few groups had previously attempted it, and their techniques weren’t practical for large-scale systems.
Page 1 of 2
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
STMicroelectronics, Metalenz Sign a New License Agreement to Accelerate Metasurface Optics Adoption
07/14/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and Metalenz, the pioneer of metasurface optics, announced a new license agreement.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.