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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Custom LIDAR Optics Support Mission-Critical Performance

05/05/2026 | PRNewswire
Meller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.

GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module

05/04/2026 | GlobalFoundries
GlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).

STMicroelectronics Expands Silicon Photonics Production for AI Demand

03/09/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.

Myrias Optics Secures $2.1M Seed Funding to Advance Wafer-Level Metaoptics

02/25/2026 | PRNewswire
Myrias Optics, a world leader in wafer-level metaoptics and diffractive optical technologies, announced the closing of a $2.1 million Seed 1 financing round in January 2026.

Lightmatter, Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure

01/27/2026 | BUSINESS WIRE
Lightmatter, the leader in photonic (super)computing, announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that integrate Cadence’s silicon-proven, high-speed SerDes IP with Lightmatter’s Passage™ optical engine.
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