Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

STMicroelectronics Expands Silicon Photonics Production for AI Demand

03/09/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.

Myrias Optics Secures $2.1M Seed Funding to Advance Wafer-Level Metaoptics

02/25/2026 | PRNewswire
Myrias Optics, a world leader in wafer-level metaoptics and diffractive optical technologies, announced the closing of a $2.1 million Seed 1 financing round in January 2026.

Lightmatter, Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure

01/27/2026 | BUSINESS WIRE
Lightmatter, the leader in photonic (super)computing, announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that integrate Cadence’s silicon-proven, high-speed SerDes IP with Lightmatter’s Passage™ optical engine.

Indium Corporation to Feature Precision Gold Solder Solutions at MD&M West 2026

01/26/2026 | Indium Corporation
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, February 3-5, in Anaheim, California.

From Pluggables to Co-Packaged Optics (CPO): The Transition Transforming Network and AI Architecture

12/22/2025 | IDTechEx
In recent years, optical transceiver technology has been steadily shifting toward placing the optics closer to the ASIC.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in