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SMTA Releases New Online Training Course on Design of Experiments

10/10/2024 | SMTA
The SMTA announced that a new 101-level online training course, “DOE 101: Design of Experiments,” is now available in the training section of the SMTA website.

Absolute EMS Expands Capabilities to Support the AI Industry with High-Complexity, High-Reliability PCB Assembly Services

10/08/2024 | Absolute EMS, Inc.
Absolute EMS, Inc., a four-time award-winning EMS provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce its enhanced printed circuit board assembly (PCBA) capabilities tailored to the fast-growing artificial intelligence

IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers

10/07/2024 | IPC
A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.

AIM to Present on Ultra-Miniature Component Assembly at SMT-Info

10/02/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.

PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs

10/01/2024 | Neil Hubble, Akrometrix and Gary A. Brist, Intel Corporation
As CPU and GPU packages grow larger and contain higher pin/ball counts, the importance of managing the printed circuit board (PCB) surface coplanarity for package assembly increases. The PCB surface coplanarity under a package is a product of both the global bow/twist of the PCB and the local surface topography under the package. In general, the surface topography is dependent the choice of material and layer stackup and the interaction between the innerlayer copper patterns and prepreg resin flow.
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