Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Nano Stencil Clean Launched
August 15, 2016 | Nano Stencil CleanEstimated reading time: 1 minute
From the makers of Smart Sonic Stencil Cleaners and 440-R SMT Detergent, Nano Stencil Clean was formulated specifically to safely clean all types of solder paste from nano-coated stencils and misprinted PCBs.
The new technology of applying a nano coating to solder paste stencils has shown significant advances to improving print yields. However, many of the nano chemistries used to provide a hydrophobic and oleophobic surface to the apertures and underside of the stencil are sensitive to elevated pH cleaning chemistries. Until the introduction of Nano Stencil Clean, manufacturers of cleaning chemicals would recommend using their “pH Neutral” cleaning chemistry. The pH Neutral cleaner would have less ill effects on the nano coating. But, because the pH Neutral product was not designed to clean solder paste, it was less effective on removing various types of solder paste from the nano coated stencil. In addition, because solvents have a neutral pH, many “pH Neutral” products obtain their neutral pH by mixing solvents into a little water and calling it a “water-based” chemistry. These “pH Neutral” products are high in VOCs and environmentally problematic.
Nano Stencil Clean is the first cleaning chemistry designed specifically to safely clean all types of solder paste from nano coated stencils. Nano Stencil Clean is environmentally safe and user safe with a low pH and nearly zero VOC content. It contains no CFCs, HCFCs, terpenes, alcohol or other hazardous ingredients and performs in ultrasonic, spray or manual cleaning applications. It is safe on all metals and plastics and REACH and RoHS compliant.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.