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Nano Stencil Clean Launched
August 15, 2016 | Nano Stencil CleanEstimated reading time: 1 minute
From the makers of Smart Sonic Stencil Cleaners and 440-R SMT Detergent, Nano Stencil Clean was formulated specifically to safely clean all types of solder paste from nano-coated stencils and misprinted PCBs.
The new technology of applying a nano coating to solder paste stencils has shown significant advances to improving print yields. However, many of the nano chemistries used to provide a hydrophobic and oleophobic surface to the apertures and underside of the stencil are sensitive to elevated pH cleaning chemistries. Until the introduction of Nano Stencil Clean, manufacturers of cleaning chemicals would recommend using their “pH Neutral” cleaning chemistry. The pH Neutral cleaner would have less ill effects on the nano coating. But, because the pH Neutral product was not designed to clean solder paste, it was less effective on removing various types of solder paste from the nano coated stencil. In addition, because solvents have a neutral pH, many “pH Neutral” products obtain their neutral pH by mixing solvents into a little water and calling it a “water-based” chemistry. These “pH Neutral” products are high in VOCs and environmentally problematic.
Nano Stencil Clean is the first cleaning chemistry designed specifically to safely clean all types of solder paste from nano coated stencils. Nano Stencil Clean is environmentally safe and user safe with a low pH and nearly zero VOC content. It contains no CFCs, HCFCs, terpenes, alcohol or other hazardous ingredients and performs in ultrasonic, spray or manual cleaning applications. It is safe on all metals and plastics and REACH and RoHS compliant.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.