The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
ACE to Exhibit Newest Soldering Technologies at SMTA International 2016
August 18, 2016 | ACE Production Technologies Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc. will exhibit its newest soldering technologies at SMTA International 2016, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, Illinois.
On display will be the KISS-101IL a fully-configured SMEMA compatible selective soldering platform equipped with standard features including automated 2-point fiducial alignment and skew correction system, high-speed Z-axis, heated nitrogen system, witness camera and automated fluxing. The KISS-101IL comes standard with the ACE automated fiducial location and correction system that provides single click fiducial teach capability, seamless fiducial recognition and true automated alignment and skew correction of the printed circuit board.
Other innovative features of the KISS-101IL include the SWAK-OS machine operating software which is a revolutionary graphics-based programming and editing machine control system that features fast program loading and program recall with minimal operator intervention. A major benefit of the SWAK-OS is the integrated board scanning function that automatically captures and saves an image of a printed circuit board to the selective soldering program.
Also on display will be the LTS100 a benchtop lead tinning machine designed for the lead tinning process whereby through-hole component leads, or terminations, can be refurbished for re-qualification in high-reliability applications. The removal of gold plating, replacing of RoHS surface finish with tin-lead finish, refurbishing of legacy components, or tin whisker mitigation are the major reasons to hot solder dip component leads.
Standard features of the LTS100 include two dynamic nitrogen inerted solder pots – one solder pot is dedicated to removal of the original plating while the second solder pot is used to apply the final plating – a dynamic flat wave fluxing station, and a forced hot air preheat station. A pallet holder holds the components in a known position throughout the process and accepts a wide variety of component types including axial, radial, DIPs, SIPs and connectors.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here , call 509-924-4898 or email sales@ace-protech.com.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.