Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Case Study: Flex Smart Factory at Fuyong
August 24, 2016 | Jeff Li, et al.*, FlexEstimated reading time: 10 minutes
Abstract
The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make factories smarter, safer and more environmentally sustainable. Get Manufacturing Functions connected with Real Time Information Systems to enable a predictive approach in all functions to serve Higher Reliability and HMLV (high-mix low-volume) services solutions.
In this paper, we will share our experience with a current project called "Smart Factory"[1], especially for Phase I of the project. Our objective is that Get Manufacturing Functions connected with real time information systems enable predictive approaches in all functions to serve Higher Reliability and High-Mix Low-Volume (HMLV) services solutions.
Through establishment of a KOI (Key Operation Indicator) structure with visualization eDashboard, we have realized the alarming abnormalities in real time and failure analysis mining from top symptoms to bottom root cause with processes correlation.
Collecting the parameters of machine and process data in real time automatically makes the connection between machines and processes to get higher efficiency for quality and production monitoring and control. Color coding for different level abnormalities gives visualization control. The real time data captured from machines and process is loaded into a central factory SPC (Statistical Process Control) system that makes predictions for taking action before failures. Real time data was sent to mobile phones to improve communication between operators and machines which has increased production efficiency.
We have seen significant achievements for the Phase I: Average yield (Final Pass Yield) increased from 99.1 % to 99.44%, NDF (No Defect Found) decreased from 2% to 0.9%, and also have SPC to be more predictive. Prevention is always better than detection[2].
Introduction
The Smart Factory project has been ongoing for more than six months. In March 2015, top management set a high goal for our factory's future: achieve Smart Factory. "Develop the company site to be a SMART factory with High-Mix Low-Volume (HMLV) service with flexibility, quality, consistency, cost effectiveness and profitability, creating value that increases customer competitiveness for win-win solutions."
A Smart Factory Implement Team was setup to start the Smart Factory journey. In this paper, experiences will be shared on this journey.
The SMART FACTORY with HMLV Services Solutions has a visualization control tower with the company site cloud which links to Smart Office, Smart Operation, Smart Supply Chain, and External Cloud which are shown in Figure 1.
Figure 1: SMART FACTORY with HMLV Services Solutions
The objective was to get Manufacturing Functions connected with real time information system to enable a predictive approach in all functions to serve higher reliability and high-mix low-volume services solutions.
What does SMART stand for? Below are our definitions.
- Strategy with Standardization
- Manufacturing with LEAN to optimize and remove WASTE
- Automation in Software and Hardware solutions
- Real Time Data control limits monitoring and triggering
- Total Quality Management with SPC to enable predictive approach
The past six months, the Smart Factory approach has been called the 5C Get Connect Elements.
- Connection (Sensors and Networks),
- Cloud (Computing data on demand)
- Content / Context (Correlation)
- Community (Corporate Social and Environmental Responsibility and Partnership Collaboration)
- Customization (HMLV)
The intelligent machine to machine or process to process setup has to provide self-optimization, self-configuration, self-diagnosis, self-learning and ability to connect with a real time information system to provide self-awareness and triggering capabilities.
The Smart Operations has a Technical Architecture and Operation Architecture that is shown in Figure 2.
The team studied the current status of the environment, process, data collection and analysis as well as yields to develop the Technical Architecture and Operation Architecture for the project.
Physical Device Layer, Connection Layer, Data Acquisition Layer, Data Storage Layer, Algorithm Layer, and Control Tower Layer are for the Technical Architecture which are shown with a blue color; and Decision Layer, Operation Layer, Execution Layer, and Service Layer are for Operation Architecture are shown with a yellow color. All of these layers are connected in real time.
Figure 2: Smart Operations - Technical Architecture and Operation Architectures
Page 1 of 4
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.