-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Case Study: Flex Smart Factory at Fuyong
August 24, 2016 | Jeff Li, et al.*, FlexEstimated reading time: 10 minutes
Figure 7: SMT – eDashboard
There are several examples of achievement in process improvement.
First we have improved Machine Parameters Collection Architecture The older machine data was not previously collected as shown on the left side of Figure 8 with red color.
The previous data parser directly accessed a controlling PC via a shared folder. This network solution was very unstable, and machine raw data was always missed for collection to SPC system.
The right side of Figure 8 shows the new Machine Raw Data Collection Network Solution.
The new collection method for raw data is now complete. The new implementation is as follows:
1. Uses a raw data center file server.
2. Software developed that uses the task scheduler on each PC to automatically upload data to the server. Thus, our parser server is able to parse data from the server.
Figure 8: Machine Raw Data Collection Network Solution
This is another example for the connection of the Smart Factory. Previously the production printer machine was isolated with parameters only available locally on the printer. It was not able to be connected to the database centralized control and for remote monitoring to correlate failures. Software has been developed to collect and upload measured parameters to the database. Key parameters (Speed, pressure, temperature, humidity….) are now monitored helping engineers to shorten the FA time.
Figure 9 shows before and after the connection of the printer to the database to collect parameters for monitoring.
Figure 9: Production Printer Parameter Monitoring
Figure 10 shows the Solder Paste Inspection (SPI) Test Data Link to Database (MES).
Prior to this link, SPI data was only available on the SPI system making it difficult to get the test result by serial number by Location and Pad ID. Quality issue root causes were difficult to be identified with the disconnected test data.
A SPI test data parser has been developed to link to MES data with product serial number by the following:
1. Allow scanning of the product barcode to correlate test results with product serial numbers.
2. Parsing of test logs to upload to the MES database. This allows traceability back to the original point of failure.
SPI test results by serial number are uploaded to the MES database where they are correlated with First Pass Yield, Units per Hour and Defects per Hour as shown on the right side of Figure 10.
Figure 10: SPI Test Data Link to MES
Table 1. Quality and Productivity Achievements from April to July of 2015
Page 3 of 4
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.