-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
I-Connect Survey: A Look at the Mil/Aero Industry
August 26, 2016 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute

I-Connect007 recently conducted a survey on the military/defense and aerospace markets. Respondents were asked about the greatest challenges when it comes to PCB design, fabrication, and assembly; their customers’ demands; whether lead-free components are still an issue; and compliance challenges.
Overall, the biggest issues include reliability, outdated drawing/specifications, component obsolescence, complicated paperwork and documentation, counterfeit components, quality, and compliance to standards.
On lead-free components
Source: I-Connect007
One of the issues encountered in the high-reliability electronics sector when the industry moved to adhere to the Restriction of Hazardous Substance (RoHS) directive is the use of lead-free components in manufacturing. Using lead-free solder, for one, has put a squeeze on military and aerospace systems designers because of the problem of tin whiskers.
However, that was ages ago, and the industry has moved to adapt lead-free alternatives and solutions. In fact, according to our survey, most companies no longer have any issues on lead-free components. They said that right now, the supply chain consists of lead-free components, so companies have figured out what to do to work with them. However, the only problem is cost, as they are more expensive.
Some issues, on the other hand, include controlling phosphate levels in lead plating; reflow temperature compatibility, and still for others, connection reliability.
On ITAR compliance
Source: I-Connect007
The International Traffic in Arms Regulations (ITAR) is a set of United States Government regulations on the export and import of defense-related articles, related technical data and defense services. EMS providers creating electronics subassemblies for military/defense applications are required to register with the Directorate of Defense Trade Controls (DDTC) in order to be ITAR compliant.
In our survey, the majority of respondents say ongoing compliance is the biggest issue when it comes to ITAR, especially when their companies are global enterprises with many businesses outside of the United States.
According to the respondents, the classifications are not based on an understanding of the technology; rather they are political, and as such subject to intense lobbying efforts—and that they are changing frequently, which leaves companies scrambling to re-classify parts of their designs on the fly.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.