Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
In Pursuit of Perfection: Defect Reduction—May 2025 PCB007 Magazine Now Available
05/15/2025 | I-Connect007 Editorial TeamFor bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.
DuPont to Showcase Advanced Semiconductor Wet Etching Innovations at the Surface Preparation and Cleaning Conference
05/13/2025 | DuPontDuPont announced that it will present its latest developments in semiconductor wet etching technologies at the upcoming Surface Preparation and Cleaning Conference (SPCC) in Chandler, Arizona, beginning May 20.
The Chemical Connection: Common Misconceptions in Wet Processing
04/28/2025 | Don Ball -- Column: The Chemical ConnectionInitially, I thought an April Fool’s column would be fun this month. I could highlight some of the crazier ideas and misconceptions I’ve witnessed over the years from potential customers and we could all have a good laugh. For example, there was a first-time buyer of a ferric chloride etcher (with no regeneration system) who was astonished to learn that he had to put fresh etchant in the system occasionally to maintain production.