-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Technica USA Adds Najib Khan to their Team
August 29, 2016 | Technica USAEstimated reading time: 1 minute
Technica USA announced today that Najib Khan as joined the company in the capacity of Product Manager of Photoimaging Products, effective August 29, 2016. Najib will be responsible for the development of Technica’s business related to photo imaging resists and inks, solder masks, chemistries and DI equipment. Najib will have direct account responsibility of servicing both existing and future customers on a national level with these specific product lines, as well as providing ongoing sales and product training support to the entire sales team.
Najib will also work along side the MLI/CBT equipment service team helping them to establish better tools for reporting services rendered as well as assisting them with additional applications support.
Frank Medina, President of Technica USA stated, “We are really excited to have Najib join our team. He brings with him a breath of knowledge and experience for this product segment.”
Najib brings with him a wealth of industry experience including his most recent position of Product Manager of Ink Jet Technology for Camtek Corporation. Prior to that, Maskless Technology Inc. employed him in the capacity of Technical Sales Manager. Najib's experience also includes over 10 years of experience working as a process engineer specializing in the photoimaging process area for pcb and microelectronic manufacturing.
About Technica, USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and assembly markets as well as the microelectronic, photovoltaic and printed electronics markets. For more information on Technica, USA, please contact Jason Perry at 1-408-240-5950 or visit them on the web at Technica.com
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.