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July 10, 2025 | SHENMAOEstimated reading time: 2 minutes
SHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging. The acquisition marks a significant step in SHENMAO’s strategic expansion into the advanced semiconductor and IC packaging market.
This milestone enhances SHENMAO’s vertical integration and reinforces its role as a key innovator and supplier for the growing global semiconductor ecosystem.
Founded in 2004, PMTC specializes in the development and manufacturing of high-end solder balls used in advanced packaging formats such as FCCSP (Flip Chip Chip Scale Packaging) and WLCSP (Wafer Level Chip Scale Packaging). PMTC is recognized globally by major IC design houses and packaging companies for its patented, high-reliability solder alloys that offer excellent ductility, thermal fatigue resistance, and drop performance.
The company brings in-house alloy development, application expertise, and a strong R&D foundation, positioning SHENMAO to accelerate innovation in semiconductor solder materials.
“The addition of PMTC to the SHENMAO Group gives us deeper access to the advanced packaging supply chain and adds new capacity, talent, and innovation in solder ball technology,” said Kelvin Li, General Manager of SHENMAO Group. “Together, we are committed to delivering high-performance materials for next-generation semiconductor applications.”
As part of its expanded focus on eco-conscious and high-reliability materials, PMTC has introduced a new patented low-temperature solder alloy, E4 (Sn47.875Bi+Ag+Cu+In+Ni), designed for temperature-sensitive assemblies and carbon-reducing manufacturing environments.
With a reflow peak temperature of ≤180°C, the E4 alloy supports lower energy consumption while maintaining the high reliability needed for consumer electronics, automotive, and advanced packaging applications.
Key Advantages of E4:
- High Reliability: The alloy’s unique formulation—including Cu, Ni, and In—improves mechanical strength, creep resistance, and thermal cycling performance.
- Controlled IMC Formation: Cu, Ni, and In form stable (Cu,Ni)₆(Sn,In)₅ intermetallic compounds, enhancing joint strength and long-term stability.
- Superior Thermal Cycling Life: E4 outperforms standard Sn42Bi58 and Sn42Bi57Ag1 alloys in thermal cycling reliability and fatigue resistance.
- Homogeneous Element Distribution: Bi remains concentrated within the solder ball, while reinforcing elements are evenly distributed at the joint interface to support stronger solder joints.
The alloy’s low melting point and stable microstructure make it ideal for low-temperature reflow processes in high-density assemblies, enabling better protection for sensitive components and contributing to lower carbon manufacturing goals.
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