-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Essemtec to Introduce the First Pick-and-Place System in its Class with Linear Motors and a Mineral Cast Frame
August 30, 2016 | EssemtecEstimated reading time: 2 minutes

Essemtec will exhibit in Booth #306 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Essemtec will demonstrate the new FOX pick-and-place machine, Spider jet dispenser and Cubus storage system.
Compact Pick-and-Place Machine
The new FOX by Essemtec is the first machine in its class with linear motors and a mineral cast frame, providing exceptional speed, stability, and accuracy, and making it perfectly suited for use in small production environments. FOX measures only 88cm x 109cm and it can accept PCBs up to 406mm x 305mm. Components with sizes from 0201 (imperial) up to 33x80mm can be placed, optionally up to 80x80mm. 4500 cph (IPC9850A) with 50 µm @ 3σ.
Essemtec’s FOX can be fitted with a dispense valve for SMD glue or solder paste for hassle-free manufacturing of 2.5D assemblies. Fox also features our award winning software ePlace found on the Paraquda, Cobra and Scorpion platforms.
Compact High-Speed Jet Dispenser
The new Spider features a dispensing capability of up to 150,000 dots/hr (with Piezo Jet Valve) and accommodates boards up to 406x305 mm. With advanced laser height mapping, Spider offers compensation for substrate warp/3D applications. Spider offers the same benefits as the Scorpion system, but in a much more compact footprint and with only two valves. Spider’s sleek design requires only 1 m² of production floor space.
Not only can it work quickly but it is accurate, placing dots within 50 µm @ 3σ at full speed, resulting in improved throughput. With three jet speed options (basic, standard and high speed), the Spider is optimized for short, ultra-fast moves. The dispenser features high maximum dispensing speeds: Jet Valve: 150,000 dots/hr; Pneumatic Jet Valve: 80,000 dots/hr; Time/Pressure Valve: 28,000 dots/hr; Archimedean Screw: 24,000 dots/hr.
Next-Generation SMT Storage System
Cubus innovates how SMT components are stored and provisioned for electronic manufacturing. For the first time, a storage device is fully user configurable and hence adapts to the dynamic manufacturing needs. There are no limitations in terms of reel sizes, reel widths or JEDEC trays. With its flexible shelf configuration, foolproof operation and easy line integration, it easily adapts to the ever-changing manufacturing environments. Thanks to its small footprint and high storage capacity (up to 932 reels), Cubus can be positioned close to any SMT manufacturing line. Cubus interfaces easily with pick-and-place machines and, thus, greatly reduces kitting time and errors as well as machine interruptions due to missing or misplaced material. Configure – Operate – Integrate!
For more information, meet with company representatives in Booth #306 at SMTA International.
About Essemtec AG
Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.