SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
Indium Corporation Experts to Present at IEMT–EMAP 2016
August 30, 2016 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.
Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.
Dr. Ning-Cheng Lee, Vice President of Technology, will lead a short course. Achieving High Reliability for Lead-Free Solder Joints will explore the detailed material considerations required for achieving high reliability in lead-free solder joints. Topics will include understanding the factors related to various failure modes, and how to select proper solder alloys and surface finishes.
Sze Pei Lim, Semiconductor Product Manager – Asia, will present No-Clean Materials for Advanced Packaging Assembly, which details how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the flip-chip, as well as in system-in-package (SiP) assembly processes. Ultra-low residue no-clean fluxes help to Avoid the Void™ by reducing the flux residue left behind after soldering, thereby decreasing the danger of delamination.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the UnitedKingdom, and the USA.
For more information about Indium Corporation, click here or email abrown@indium.com.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.
Elmotec by E-Tronix to Showcase SolderSmart® TOP Robotic Soldering at The Assembly Show 2025
10/06/2025 | ELMOTECE-tronix, a Stromberg Company, is pleased to announce its participation at The Assembly Show 2025 in Rosemont, IL, October 21st through 23rd. Exhibiting under Elmotec by E-Tronix, Booth #448, the team will highlight the SolderSmart® TOP robotic soldering system, featuring live demonstrations throughout the show.