American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
DS Electronics Installs Fourth ACE Selective Soldering Machine
August 30, 2016 | ACE Production Technologies, Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc. announced that DS Electronics has invested in a fourth KISS-103 selective soldering machine.
The KISS-103 selective soldering system has been installed at the DS Electronics, Inc. facility located in Tempe, Arizona and is the fourth selective soldering machine DS Electronics has ordered from ACE Production Technologies.
“The KISS-103 is a fully-configured selective soldering platform equipped with numerous standard features including heated nitrogen inerting, high speed Z-axis for “Super Quick” processing speeds, look-up camera for easy programming, automatic solder level makeup, auto wave height detection, and board warp compensation,” said Alan Cable President of ACE Production Technologies. “The KISS-103 comes standard with the ACE automated fiducial location and correction system providing single click fiducial teach capability, seamless fiducial recognition and true automated alignment and skew correction of the printed circuit board.”
Cable added, “Other innovative features include the new SWAK-OS machine operating software which is a revolutionary graphics-based programming and editing machine control system that features fast program loading and program recall with minimal operator intervention. A major benefit of the SWAK-OS is the integrated board scanning function that automatically captures and saves an image of a printed circuit board to the selective soldering program.”
DS Electronics, Inc. is a privately-held electronics manufacturing service company specializing in quick-turn printed circuit board and electronics assembly. Their range of services includes prototype assembly, single-sided, double-sided and multilayer printed circuit board assembly, multichip modules and assembly of system level hardware. DS Electronics serves various OEM customers including manufacturers of communications and instrumentation systems.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here, call 509-924-4898 or email sales@ace-protech.com.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.