Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Scienscope to Display the Latest Innovation in Counting Components at SMTAI
August 30, 2016 | Scienscope InternationalEstimated reading time: 1 minute
Scienscope International, a complete inspection solutions provider, will exhibit in Booth #124 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Scienscope will showcase the new AXI5100c X-ray Component Counter along with the X-Scope 2000 X-ray system.
The AXI5100c is a new innovation in counting components, capable of counting 01005s with ease, as well as (4) 7" or (1) 15" reels of various thicknesses.
Accurate component count is vital for inventory management and production efficiency. Currently, this is a time consuming, labor intensive process. Most machines require an operator load, and run through each individual reel to count the components. The count is then manually recorded. Counting using X-ray technology and intelligent algorithms can take as little as seven seconds for an entire reel, and can interface directly with inventory management software to transfer the count instantly. It’s less than the time
normally needed to load a reel on a manual counter. The result is less time and labor to count, and more error proof recording of the results.
The Scienscope AXI 5100c is an automated, fast, accurate component counting machine designed to increase productivity.
The X-Scope 2000 is a general purpose, high resolution, fully programmable X-ray system designed to address the non-destructive testing needs for failure analysis, research and development, process development, process monitoring and the ongoing support of electronics assembly, rework and repair. The X-Scope 2000 is a “batch”, semi-automatic X-ray system and includes a Windows-based workstation with multiple image processing functions for real-time measurement and data collection. The X-Scope 2000 features a 90 Kv X-ray source with a 5-micron spot size, and a 4" x 3" high-resolution digital flat panel detector that can tilt up to 50° for oblique angle viewing.
About Scienscope International
Scienscope was founded in 1994 to meet the growing need for reliable and affordable general-purpose optical and video inspection solutions for the electronics and PCB industries. The company began with basic stereo zoom microscopes used for SMT inspection and rework of circuit boards and electromechanical assemblies with a commitment to quality, value and support. Over the past 20 years, Scienscope has evolved to become a complete inspection solution provider, offering both offline and inline X-Ray systems, Video coordinate measurement systems, Video inspection systems, and microscopes to meet a wide variety of applications and manufacturing quality requirements.
Share on:
Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.