The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Alpha to Present Technical Paper on Low Voiding High Reliability Solder Paste at IPC Technical Conference in India
September 1, 2016 | Alpha Assembly SolutionsEstimated reading time: 3 minutes
Alpha Assembly Solutions will be presenting a technical paper titled “Low Voiding High Reliability Solder Paste for Automotive, LED and other Demanding Applications” at the IPC India Technical Conference to be held on September 22, 2016.
Electronic assemblies used in automotive, telecommunications, high power LEDs, and other demanding applications require soldering materials that can withstand high temperature, vibration, thermal shock and other harsh conditions. For example, electronics in automotive applications typically require enhanced vibration and thermal cycling performance. Assemblies in telecommunications require enhanced thermal cycling, while assemblies in lighting (high power LEDs) require creep-resistant material at high operating temperatures.
In order to meet these various demanding applications, a new high reliability, RoHS-compliant alloy was developed. This paper will cover the reliability properties of the new alloy. Further, a new halogen-free flux vehicle system was optimized for this alloy. Following this, case studies for two applications, Automotive and LED Lighting, are covered in this paper.
IPC India Technical Conference
Date: Thursday, September 22, 2016
Time: 10:50am – 11:15am
Venue: Bangalore International Exhibition Centre
10th Mile, Tumkur Road, Madavara Post, Dasanapura Hobli, Bengaluru, Karnataka 562123, India
Topic: Low Voiding High Reliability Solder Paste for Automotive, LED and other Demanding Applications
Presented by: Richard Puthota, Business Development Director of Alpha Assembly Solutions
To learn more about Alpha Assembly Solutions’ vast product offering and capabilities, please visit our website at AlphaAssembly.com
Speaker Biography
Richard Puthota is a Director of Business Development & Technical Support at Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, where he is responsible for Alpha’s Business & Technical Support in India, Africa, Sri Lanka & Middle-East. Being a process specialist (both in bare board manufacturing &board assembly) he undertakes process audits for OEMs, EMS and train & Certify Management staff. He adds sustainable & tangible value to Alpha’s customers across the Indian subcontinent. Recently, he received the “President Award for the year of 2014” for creating an entire business model for sales, distribution channels & branding which led to share gain and continued growth in South Africa, a new market for the business.
Richard has over 31 years experience in PCB assembly industry. He holds BS Chemical Technology and PGD in Applied Chemistry from Loyola College and Executive Education from IIM-Bangalore. Richard currently serves as Member of Corporate Advisory Board of SRM University, Industrial Advisory Committee of Loyola College and also Advisory Panel of India’s Electronics Magazines
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.