-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec International Doubles IMS Material Manufacturing Capacity with $2M Equipment Investment
September 2, 2016 | Ventec International GroupEstimated reading time: 1 minute

Ventec International Group has doubled its B-series Insulated Metal Substrate (IMS) materials production capacity at its Jiangyin, China facility. The company has invested USD 2 million in leading edge production equipment that boost IMS materials production capacity 100% above prior levels.
Image: Ventec raises production capability & control for IMS production line with increased capacity
To meet the growing demand for high performance IMS materials that deliver an ever-increasing level of thermal performance, reliability and quality, particularly for automotive and other LED lighting and DC power conversion applications, Ventec has invested in new manufacturing equipment at its Jiangyin, China facility. Following a successful initial trial period, the latest production line, which includes a Resin Coater, automated build up, aluminum surface treating equipment, and an inline High Pot Tester, is now fully operational for mass production.
Image: Ventec’s new Resin Coater doubles IMS Materials capacity
Along with the significant capacity expansion, the latest investment also ensures enhanced production capability for Ventec’s VT-4B family of thermally conductive IMS, which deliver an unprecedented level of thermal performance through their established ceramic-filled halogen-free dielectric technology. Multilayered constructions are made possible through resin-coated foil and resin-coated film options.
Image: Thermal Management Solutions & IMS Materials Performance Overview from Ventec
Ventec’s General Manager Jason Chung said the company is on track with its ambitious global growth plan which includes strategic investment in new technologies and production equipment that expand its product offerings and leverage production resources. “With the market need for ever-increasing thermal performance, Vantec’s IMS Materials product pipeline and manufacturing capacity expansion are now well positioned to cost-effectively meet the needs of customers around the globe,” Chung said.
Mark Goodwin, Ventec’s COO Europe & USA, added “the Jiangyin facility’s expanded production capacity positions Ventec to serve as a leading high-volume, high-quality supplier of materials to customers requiring reliable IMS solutions,”.
About Ventec International Group
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
Suggested Items
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Trump Copper Tariffs Spark Concern
07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.