-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha's Jason Fullerton to Present at Upcoming SMTA Michigan Chapter Technical Session
September 6, 2016 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions is participating in the upcoming SMTA Michigan Chapter on September 12 as a technical presenter.
A presentation on "The Discrepancy Between Ionic Contamination and SIR Testing in Predicting Electrical Reliability" will be given by Jason Fullerton, Customer Technical Support Engineer for Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses. Among the topics covered, Fullerton will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
"Many users of no-clean solder pastes treat ROSE (Resistance of Solvent Extract) testing as suitable to ascertain whether or not flux residues will be detrimental to the long-term reliability of printed circuit assemblies," said Jason Fullerton. "However, when compared to SIR (Surface Insulation Resistance) testing, the results of ROSE tests can be shown to provide different results than SIR on the same materials."
The technical session will be following by a golf outing, both to be held at the Oak Pointe Country Club in Brighton, Michigan. Registration for both the technical presentations and golf outing is free, courtesy of the Michigan SMTA.
Additional information:
SMTA Michigan Chapter Technical Session & Golf Outing
September 12, 2016
Oak Pointe Country Club
4500 Club Dr. Brighton, MI 48116
9:30AM – Registration
10:00 AM – Technical Meeting in Clubhouse
12:00PM – Shotgun start
The Discrepancy Between Ionic Contamination and SIR Testing in Predicting Electrical Reliability
Presented by: Jason Fullerton – ALPHA ASSEMBLY SOLUTIONS
Speaker Biography – Jason Fullerton
Jason has over 20 years of experience in manufacturing operations in the automotive, high-reliability, and commercial electronics industries, specializing in SMT and wave soldering processes. He has also worked at a failure analysis lab and IPC Training Center near his hometown of Philadelphia. He earned his Bachelor's Degree in Manufacturing Engineering from GMI Engineering & Management Institute (now Kettering University) in Flint, MI. Additionally, Jason is an ASQ Certified Quality Engineer, Six Sigma Black Belt, and Reliability Engineer and has published and presented at a number of IPC and SMTA meetings.
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.