Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
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IPC Technical Education — PCB Troubleshooting
September 8, 2016 | IPCEstimated reading time: Less than a minute
Join IPC on November 2, 2016 for PCB Troubleshooting: Advanced Problem-Solving. The course will address many costly defects you may encounter, including: interconnect separation, delamination, wedge voids, plating folds, micro-voids, and hole-wall pull-away. Root cause is not always readily apparent, and participants will learn to trace problems through the manufacturing process — and prevent them.
- Explore a range of electrodeposition defects, such as mouse bites, pitting, and domed or crown plating.
- Learn about solderability and other assembly-related issues, such as outgassing, black pad, creep corrosion and blow holes
- Gain strategies to address solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating
This full-day course will benefit team members involved in PCB fabrication and assembly.
Registration includes a copy of the instructor’s PowerPoint presentation and access to all activities at PCB Carolina. Class will be held in conjunction with this exhibition, which is presented by the local chapter of the IPC Designers Council. Students are encouraged to take advantage of the additional technical education offered by exhibits. For more information about the event, click here.
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