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IPC Technical Education — PCB Troubleshooting
September 8, 2016 | IPCEstimated reading time: Less than a minute
Join IPC on November 2, 2016 for PCB Troubleshooting: Advanced Problem-Solving. The course will address many costly defects you may encounter, including: interconnect separation, delamination, wedge voids, plating folds, micro-voids, and hole-wall pull-away. Root cause is not always readily apparent, and participants will learn to trace problems through the manufacturing process — and prevent them.
- Explore a range of electrodeposition defects, such as mouse bites, pitting, and domed or crown plating.
- Learn about solderability and other assembly-related issues, such as outgassing, black pad, creep corrosion and blow holes
- Gain strategies to address solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating
This full-day course will benefit team members involved in PCB fabrication and assembly.
Registration includes a copy of the instructor’s PowerPoint presentation and access to all activities at PCB Carolina. Class will be held in conjunction with this exhibition, which is presented by the local chapter of the IPC Designers Council. Students are encouraged to take advantage of the additional technical education offered by exhibits. For more information about the event, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.