-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA China Presents Seven Best-Paper/Presentation Awards and Two Best Exhibit Awards
September 9, 2016 | SMTA ChinaEstimated reading time: 1 minute
SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.
IBM Procurement China Limited’s Robin Hou was awarded The Best Paper of Technology Conference One for the paper titled “The Challenge and Solution for Rework of Array Components.”
Flex’s Henley Zhou was awarded The Best Paper of Technology Conference Two for the paper titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process.”
Pacrim Technology Inc.’s Dr. Wayne Koh received the award for The Best Presentation of Technology Conference One for the presentation titled “Package Warpage Control and SMT Solder Joint Defects.”
Flex’s Henley Zhou received the award for The Best Presentation of Technology Conference Two for the presentation titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process.”
Jason Chan, from KYZEN, received the award for The Best Presentation of Vendor Conference One for the presentation titled “Video Analysis of Solder Paste Release From Stencils.”
Jason Chuah, from Kirsten Soldering AG, received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Breakthrough of THT Soldering Solution.”
Dragon Zhang, from BPM Microsystems, received the award for The Best Presentation of Vendor Conference Three for the presentation titled “The Landmark Innovation for Device Programming.”
Kirsten received the award for The Best Emerging Exhibit of the Year 2016 China South with the product “Modula The Soldering System,” Model “The Modula Wave.”
BTU received the award for The Best Exhibit Technology of the Year 2016 China South with the product “Reflow Oven”, Model of “PYRAMAX 125N.”
For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail: peggychen@smta.org.cn.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.