Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
The Balver Zinn Group Goes with LLE Soluciones to Guadalajara for the SMTA Mexico Expo & Tech Forum
September 19, 2016 | Balver Zinn GroupEstimated reading time: 2 minutes
The Balver Zinn Group announces that they will exhibit together with LLE Soluciones at the SMTA Mexico Expo & tech Forum on booth #17. The SMTA Expo is scheduled to take place October 5-6, 2016 at the Riu Hotel in Guadalajara, Mexico. Representatives from LLE and Balver Zinn will display the company’s OT2M solder paste, Brilliant B2012 solder wire, SN100C® alloy along with the latest flux technology.
Cobar OT2M is a rosin based solder paste classified as ROL0 according J-STD-004 and available in all common alloys. Cobar OT2M exhibits a long stencil life, excellent wetting performance and reduces voiding. The unique flux formulation produces clear and hardly visible residues and is available as a no-clean formulation for all applications such as high-end and automotive.
To ensure a committed supply of Cobar solder paste to our valued customer in Mexico the Cobar OT2M solder paste will be produced by LLE Soluciones to reduce customer lead-times and costs.
Brilliant B2012 solder wire is halide-free, rosin based and designed for manual and robotic soldering. B2012 is odorless and shows excellent solder and wetting performance. Brilliant B2012 is available in SN100C®, SAC305 (SN97C) and Sn63 alloys with a standard flux content of 2,2 percent. Balver Zinn wires are available in diameters from 0.3 to 3.5mm.
Also on display at SMTA Mexico will be the unique and highly respected lead-free solder SN100C® range. SN100C® is a nickel-stabilized tin copper eutectic alloy, containing a small amount of Germanium to minimize oxidations. SN100C® offers bright and shiny solder joints, comparable with lead-containing joints.
In response to market demands, the Balver Zinn Group developed a high-end, No-Clean rosin based flux technology for wave and selective soldering applications. Cobar flux 390-RO-HT is a modified version of the high reliable 390-RX-HT flux and is classified ROL0 according to IPC standard J-STD-004.
390-RO-HT offers the highest reliability in humid environmental conditions and provides outstanding soldering results for use in high-tech and industrial applications.
About LLE Soluciones
Located in Guadalajara Mexico, LLE Soluciones Quimicas is a distributor of chemicals and materials and as exclusive distributor of Cobar Solder Products representing the entire portfolio of Balver Zinn-Cobar branded solder products including the highly respected range of Balver Zinn SN100C® products.
About the Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in Europe, the United States, and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste, adhesives and miscellaneous services and soldering products.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.