-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
KYZEN Offers IPA Alternatives for Stencil Cleaning at productronica India
September 19, 2016 | KyzenEstimated reading time: 1 minute

KYZEN will exhibit with its distributor, Kreative Technologies, in Booth #3429 at productronica India, which will be held from September 21-23, 2016 in Bangalore. The KYZEN team will highlight IPA replacements and its AQUANOX A4625 versatile aqueous cleaning chemistry.
The evidence from a recent objective study conducted by KYZEN includes process videos and strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition. The study concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as CYBERSOLV C8882 than they are with standard IPA.
CYBERSOLV C8882 is a state-of-the-art IPA alternative for stencil cleaning. A fast-acting stencil cleaning solvent, C8882 is designed for the understencil wipe and hand cleaning processes. C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin, and low residue no-clean fluxes.
KYZEN will also feature its award-winning AQUANOX A4625, designed specifically for batch cleaning systems containing low VOCs. A4625 is effective on no-clean and lead-free residues.
With more than 25 years of experience and more than 50 industry awards, KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.