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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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ECWC14 Seeking Abstracts for 14th Electronic Circuits World Convention
September 30, 2016 | IPCEstimated reading time: Less than a minute
The 14th Electronic Circuits World Convention (ECWC14) will be held in KINTEX, Goyang City, South Korea from April 25 to April 27, 2017 along with the KPCA Show hosted by Korea Printed Circuits Association (KPCA) and the World Electronic Circuits Council (WECC). This premier international conference is a triennial event for a world-class gathering of professionals from academia, industry and government, providing a forum to exchange ideas and recent developments in various fields of electronic interconnection and fostering networking and collaborations.
In line with this, the ECWC14 is inviting submission of abstracts on a wide range of topics, spanning both business and technical topics. The topics of interest include, but not limited to:
Management
- Market Trends and Outlook
- Supply Chain Management (SCM)
- Standard, Certification and Qualifications
- Environment, Health and Safety (EHS)
- Business Strategy
Technology
- Materials and Components
- Design and Data Transfer
- Test and Reliability
- Processes, Chemical and Physical
- HDI / Fine Circuit Fabrication, Processes and Equipment
- Flexible Circuit
- Application Specific Circuits
- Packaging/Substrate Technology
- SMT and Assembly
- Emerging Technologies
The abstract submission deadline is September 30, 2016. For more information, please contact Dr. Tim Lee, ECWC 14 Secretariat.
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