-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ECWC14 Seeking Abstracts for 14th Electronic Circuits World Convention
September 30, 2016 | IPCEstimated reading time: Less than a minute
The 14th Electronic Circuits World Convention (ECWC14) will be held in KINTEX, Goyang City, South Korea from April 25 to April 27, 2017 along with the KPCA Show hosted by Korea Printed Circuits Association (KPCA) and the World Electronic Circuits Council (WECC). This premier international conference is a triennial event for a world-class gathering of professionals from academia, industry and government, providing a forum to exchange ideas and recent developments in various fields of electronic interconnection and fostering networking and collaborations.
In line with this, the ECWC14 is inviting submission of abstracts on a wide range of topics, spanning both business and technical topics. The topics of interest include, but not limited to:
Management
- Market Trends and Outlook
- Supply Chain Management (SCM)
- Standard, Certification and Qualifications
- Environment, Health and Safety (EHS)
- Business Strategy
Technology
- Materials and Components
- Design and Data Transfer
- Test and Reliability
- Processes, Chemical and Physical
- HDI / Fine Circuit Fabrication, Processes and Equipment
- Flexible Circuit
- Application Specific Circuits
- Packaging/Substrate Technology
- SMT and Assembly
- Emerging Technologies
The abstract submission deadline is September 30, 2016. For more information, please contact Dr. Tim Lee, ECWC 14 Secretariat.
Suggested Items
Wolfspeed Stock Soars After Filing for Chapter 11 Bankruptcy
07/01/2025 | I-Connect007 Editorial TeamOn July 1, Wolfspeed shares doubled following the company’s announcement on June 30 that it had filed for Chapter 11 bankruptcy protection.
Zollner Completes Full Acquisition of Bluechips Microhouse
07/01/2025 | Zollner Elektronik AGZollner Elektronik AG has successfully finalized its com- plete takeover of Bluechips Microhouse Co., Ltd., in Thailand. In the future the company will operate as part of the Zollner Group of companies under the leadership of Thomas Kiefl – strategically networked, technologically focused and internationally oriented.
Inission Acquires the Lithuanian Company Selteka
07/01/2025 | InissionInission AB has signed an agreement to acquire 100% of UAB Selteka. Selteka is a well-respected EMS (electronics manufacturing services) company with operations located in Kaunas, Lithuania.
RTX, Shield AI Partner to Develop New Defense Capabilities
07/01/2025 | RTXRTX and Shield AI announced a new partnership to integrate Shield AI capabilities into select RTX defense products, like loitering munitions and sensors. This collaboration will deliver enhanced, autonomous capabilities to US and allied defense forces.
Lockheed Martin Completes Acquisition of Amentum’s Rapid Solutions Portfolio
07/01/2025 | Lockheed MartinLockheed Martin has closed its acquisition of the Rapid Solutions business of Amentum, an engineering and technology solutions company.