-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
The Town Crier
Column from: Dan Smith
Daniel J. Smith is a principal technologist for Raytheon Missile Systems, where he manages a team that installs and supports all EDA tools used by the company's electrical engineers. Previously, he served in technical roles at Motorola, Mentor Graphics, and Northrop Grumman. Smith was also a professional musician for 31 years, working as a pianist, musical arranger, conductor, and bassist. He is a member of the Porch Dawgs PCB industry band.
Smith has taught multiple aspects of the PCB design process internationally, and he has authored several PCB-related patents, articles, and standards for over 30 years.