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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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The Town Crier
Column from: Dan Smith
Daniel J. Smith is a principal technologist for Raytheon Missile Systems, where he manages a team that installs and supports all EDA tools used by the company's electrical engineers. Previously, he served in technical roles at Motorola, Mentor Graphics, and Northrop Grumman. Smith was also a professional musician for 31 years, working as a pianist, musical arranger, conductor, and bassist. He is a member of the Porch Dawgs PCB industry band.
Smith has taught multiple aspects of the PCB design process internationally, and he has authored several PCB-related patents, articles, and standards for over 30 years.