- pcb007 Magazine
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
- Events||| MENU
- pcb007 Magazine
Volunteers Honored for Contributions to IPC and Electronics IndustrySeptember 30, 2016 | IPC
Estimated reading time: 5 minutes
IPC – Association Connecting Electronics Industries presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Illinois. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
For his leadership of the 7-31m Fiber Optic Cable Acceptability Task Group that developed IPC-D-640, Design and Critical Process Requirements for Optical Fiber, Robert Cooke, NASA Johnson Space Center, was honored with a Committee Leadership Award. Earning a Distinguished Committee Service Award for their contributions to IPC-D-640, were Richard Agard, Septa; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Don Branscombe, STM – Service To Mankind; Caroline Ehlinger, Rockwell Collins; Stephen Fribbins, Fribbins Training Services; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Larry Johnson, Light Brigade; Kathy Johnston, Raytheon Missile Systems; Sean Keating, Amphenol Limited (UK); Theodore Laser, L-3 Communications; Gregory Manning, Ares Corp.; James McGrath, Lockheed Martin Mission Systems & Training; Craig Portz, Fujitsu Network Communications; Brian Smith, Rockwell Collins; Hector Valladares, Honeywell Aerospace; Debbie Vorwald, Rockwell Collins; and Schuyler Williams, Lockheed Martin Missile & Fire Control.
For their leadership of the 7-31a IPC-A-600 Task Group that developed IPC-A-600J, Acceptability of Printed Boards, Mark Buechner, BAE Systems and Randy Reed, R. Reed Consultancy LLC, earned a Committee Leadership Award. For their contributions to IPC-A-600J, Denise Chevalier, Amphenol Printed Circuits, Inc.; Lorraine Hook, Streamline Circuits; Chris Mahanna, Robisan Laboratory Inc.; Debora Obitz, NTS – Anaheim; and Joey Rios, Massachusetts Institute of Technology, earned a Distinguished Committee Service Award.
Leaders of the 7-31AT IPC-A-600 Technical Training Committee that developed the training and certification Program for IPC-A-600J, Acceptability of Printed Boards, Leo Lambert, EPTAC Corporation and Debora Obitz, NTS – Anaheim, received a Committee Leadership Award. For their extraordinary contributions to the training and certification program for IPC-A-600J, Elizabeth Allison, NTS – Baltimore and Renee Michalkiewicz, NTS – Baltimore, received a Special Recognition Award. Helena Pasquito, EPTAC Corporation; Russell Shepherd, NTS – Anaheim; and Debbie Wade, Advanced Rework Technology-A.R.T., received a Distinguished Committee Service Award for their contributions to the training and certification program.
For their leadership of the D-22 High Speed/High Frequency Board Performance Subcommittee that developed IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards, Lance Auer, Raytheon Missile Systems and Mahendra Gandhi, Northrop Grumman Aerospace, earned a Committee Leadership Award.
A Distinguished Committee Service Award was presented to Clifford Maddox, Boeing Company; Randal Oberle, Raytheon Company; William Ortloff, Raytheon Company; Randy Reed, R. Reed Consultancy LLC; Joey Rios, Massachusetts Institute of Technology; and Edward Sandor, Taconic Advanced Dielectric Division, for their contributions to IPC-6018C.
For their leadership of the D-22 High Speed/High Frequency Board Performance Subcommittee that developed IPC-6018CS, Space and Military Avionics Applications Addendum to IPC-6018C, Lance Auer, Raytheon Missile Systems and Mahendra Gandhi, Northrop Grumman Aerospace Systems, earned a Committee Leadership Award. For their contributions to IPC-6018CS, Steven Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati; Kelly Daniluk, NASA Goddard Space Flight Center; Don Dupriest, Lockheed Martin Missiles & Fire Control; James Monarchio, TTM Technologies, Inc.; and William Ortloff, Raytheon Company, earned a Distinguished Committee Service Award.
Committee Leadership Awards were bestowed upon Don Dupriest, Lockheed Martin Missiles & Fire Control and Joseph Kane, BAE Systems Platform Solutions, for leading the D-35 Printed Board Storage and Handling Subcommittee that developed IPC-1601A, Printed Board Handling and Storage Guidelines. For their contributions to IPC-1601A, Scott Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati; Bev Christian, ABC Electronics Manufacturing Consulting; Brian Madsen, Continental Automotive Systems; and Bhanu Sood, NASA Goddard Space Flight Center, received a Distinguished Committee Service Award.
For their leadership of the 5-32e Conductive Anodic Filament (CAF) Task Group that developed IPC-9691B, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing, Karl Sauter, Oracle America, Inc. and Russell Shepherd, NTS – Anaheim, earned a Committee Leadership Award. For their extraordinary contributions to IPC-9691B, Antonio Caputo, Massachusetts Institute of Technology and Graham Naisbitt, Gen3 Systems Limited, received a Special Recognition Award. Distinguished Committee Service Awards were presented to Douglas Eng, PPG Industries Inc.; Todd MacFadden, Bose Corporation; Renee Michalkiewicz, NTS – Baltimore; and Bhanu Sood, NASA Goddard Space Flight Center, for their contributions to the document revision.
George Milad, Uyemura International Corp. and Gerard O’Brien, Solderability Testing and Solutions, Inc., earned Committee Leadership Awards for helming the 4-14 Plating Processes Subcommittee that developed IPC-TM-650, Method 2.3.44, Determination of Thickness and Phosphorus Content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry. For his extraordinary contributions to IPC-TM-650, Method 2.3.44, Michael Haller, Fischer Technology Inc., received a Special Recognition Award. Martin Bayes, TE Connectivity; Christopher Daczkowski, Atotech USA Inc.; Don Dupriest, Lockheed Martin Missiles & Fire Control; Douglas Eng, PPG Industries Inc.; William Fox, Lockheed Martin Missile & Fire Control; Lisa Gamza, MacDermid Enthone; Donald Gudeczauskas, Uyemura International Corp.; Colleen McKirryher, Formerly with MacDermid Enthone Electronics Solutions; Thi Nguyen, Lockheed Martin Missile and Fire Control; and Mario Rosin, Atotech Deutschland GmbH, received a Distinguished Committee Service Award for their contributions to IPC-TM-650, Method 2.3.44.
For his leadership of the 2-15f Obsolete and Discontinued Product Task Group that developed IPC/JEDEC/ECA J-STD-046, Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers, Curtis Grosskopf, IBM Corporation, earned a Committee Leadership Award.
For more information on these awards or the award recipients, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Collins Aerospace, an RTX business, has been selected by Air India for a full suite of avionics hardware catering to the airline's expanding Boeing 737 MAX fleet.
Further to the announcement of 17 August 2023, BAE Systems has now received the necessary regulatory approvals and will be executing steps in the coming days to complete the acquisition of Ball Aerospace from Ball Corporation.
With such an extremely newsy week, it was hard to select just five items you absolutely must read, but here goes. We have advocacy news from PCBAA and IPC, global market data on AI PC and GenAI smartphone hardware, a roundtable discussion on sales and marketing, a bookended pair of international milaero stories emphasizing a healthy aerospace industry, and an industry report on global semiconductor sales.
Honeywell announced it will invest $84 million to expand its Olathe manufacturing facility in Kansas. The project, which is expected to generate nearly $47 million in total gross domestic product (GDP) and contribute $18.3 million to state and local taxes in the first six years, supports the company's alignment with the compelling megatrend of the future of aviation.
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards.