Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Top 10 Most-Read PCB News Stories of 2016
December 30, 2016 | I-Connect007Estimated reading time: 2 minutes
As the year ends, look back at the industry's highs and lows. The editors at I-Connect007 have compiled a list of the top 10 most-read news stories from the pages of PCB007. Join us for a look back at the most popular news highlights of 2016.
At #10, IPC Joins NextFlex
IPC — Association Connecting Electronics Industries has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, Calif. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.
At #9, Eltek Purchased the New Orbotech Diamond 8 Solder Mask System
ORBOTECH LTD announced today that Eltek, a Nistec company and long-time Orbotech customer, has been successfully using the new Orbotech Diamond 8 Direct Imaging (DI) system for solder mask at its production facility in Petach Tikvah, Israel.
Summit Interconnect, Inc. subsidiary KCA Electronics was recently recognized by Lockheed Martin Corporation at their Small Business Awards Event. An award for KCA’s outstanding product quality, service and support was presented to Shane Whiteside, President and CEO of Summit Interconnect and Eva Alcantar, Inside Sales Manager for KCA Electronics.
At #7, N.A. PCB Book-to-Bill Ratio Increases to 1.04 in January
IPC — Association Connecting Electronics Industries announced today the January 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders slumped in January, but orders continued to outpace sales, bringing the book-to-bill ratio up to 1.04.
At #6, KCA Electronics and MEI Acquired by HCI; Shane Whiteside Named President & CEO
HCI Equity Partners (HCI), a middle market private equity firm based in Washington DC, announced today that it has acquired both KCA Electronics in Anaheim, CA and Marcel Electronics International (MEI) located in Orange, CA in separate stock transactions.
At #5, AT&S Receives Certification for New IC Substrate Plant in China
AT&S, one of the global technology leaders for high-end printed circuit boards (PCBs), received the certification for its new plant in Chongqing, China, after roughly 17 months of comprehensive development for the serial production of IC substrates. As a result, serial production will start for the first of two production lines.
At #4, HSIO Circuit Technologies Acquires former HEI Circuit Fabrication Operation in Tempe, AZ
This acquisition complements the 2012 asset acquisition of R&D Interconnect Solutions to provide the industry leading combination of high performance Printed Circuit, Semiconductor Test Socket, Wafer Probe and Connector products available with over 60 US and International patents issued, granted, licensed and pending with tuned performance beyond 40 GHz.
At #3, FTG Circuits - Chatsworth California Qualified to MIL- PRF-31032
The FTG Circuits - Chatsworth California facility has been qualified to the Department of Defense performance specification MIL-PRF-31032/3 (flexible printed wiring boards) and MIL-PRF-31032/4 (flex-rigid printed wiring boards).
At #2, PCB Technologies Receives NADCAP Accreditation
PCB Technologies received Nadcap accreditation for demonstrating their ongoing commitment to quality by satisfying customer requirements and industry specifications.
At #1, AT&S Offers Expanded PCB Sales Support in the U.S.
AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, is committed to absolute customer orientation supporting its vision: “First choice for advanced applications”.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.