Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Top 10 Most-Read PCB News Stories of 2016
December 30, 2016 | I-Connect007Estimated reading time: 2 minutes
As the year ends, look back at the industry's highs and lows. The editors at I-Connect007 have compiled a list of the top 10 most-read news stories from the pages of PCB007. Join us for a look back at the most popular news highlights of 2016.
At #10, IPC Joins NextFlex
IPC — Association Connecting Electronics Industries has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, Calif. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.
At #9, Eltek Purchased the New Orbotech Diamond 8 Solder Mask System
ORBOTECH LTD announced today that Eltek, a Nistec company and long-time Orbotech customer, has been successfully using the new Orbotech Diamond 8 Direct Imaging (DI) system for solder mask at its production facility in Petach Tikvah, Israel.
Summit Interconnect, Inc. subsidiary KCA Electronics was recently recognized by Lockheed Martin Corporation at their Small Business Awards Event. An award for KCA’s outstanding product quality, service and support was presented to Shane Whiteside, President and CEO of Summit Interconnect and Eva Alcantar, Inside Sales Manager for KCA Electronics.
At #7, N.A. PCB Book-to-Bill Ratio Increases to 1.04 in January
IPC — Association Connecting Electronics Industries announced today the January 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders slumped in January, but orders continued to outpace sales, bringing the book-to-bill ratio up to 1.04.
At #6, KCA Electronics and MEI Acquired by HCI; Shane Whiteside Named President & CEO
HCI Equity Partners (HCI), a middle market private equity firm based in Washington DC, announced today that it has acquired both KCA Electronics in Anaheim, CA and Marcel Electronics International (MEI) located in Orange, CA in separate stock transactions.
At #5, AT&S Receives Certification for New IC Substrate Plant in China
AT&S, one of the global technology leaders for high-end printed circuit boards (PCBs), received the certification for its new plant in Chongqing, China, after roughly 17 months of comprehensive development for the serial production of IC substrates. As a result, serial production will start for the first of two production lines.
At #4, HSIO Circuit Technologies Acquires former HEI Circuit Fabrication Operation in Tempe, AZ
This acquisition complements the 2012 asset acquisition of R&D Interconnect Solutions to provide the industry leading combination of high performance Printed Circuit, Semiconductor Test Socket, Wafer Probe and Connector products available with over 60 US and International patents issued, granted, licensed and pending with tuned performance beyond 40 GHz.
At #3, FTG Circuits - Chatsworth California Qualified to MIL- PRF-31032
The FTG Circuits - Chatsworth California facility has been qualified to the Department of Defense performance specification MIL-PRF-31032/3 (flexible printed wiring boards) and MIL-PRF-31032/4 (flex-rigid printed wiring boards).
At #2, PCB Technologies Receives NADCAP Accreditation
PCB Technologies received Nadcap accreditation for demonstrating their ongoing commitment to quality by satisfying customer requirements and industry specifications.
At #1, AT&S Offers Expanded PCB Sales Support in the U.S.
AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, is committed to absolute customer orientation supporting its vision: “First choice for advanced applications”.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).