-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Meyer Burger Supplies CONx Microfab R&D and Pilot Production System at NextFlex
June 2, 2017 | Meyer BurgerEstimated reading time: 3 minutes
Meyer Burger, in partnership with DuPont, Eastman Chemical and Intrinsiq Materials, is delivering a CONx Microfab cluster tool that includes two PiXDRO IP410 inkjet printing systems, a FLEx LT PECVD deposition system, automation, and on-board metrology that will enable multilayer, multi material additive depositions for complex FHE structures.
Meyer Burger’s fully automated GEN2.5 multi-process CONx Microfab will be used to manufacture FHE (Flexible Hybrid Electronics) devices and will leverage key partners’ materials for development and product prototyping. The dual-station dual-head inkjet printing capability enables real-time metrology for advanced process control and world-record sub-15-micron feature-size printing. Maximum flexibility in product prototyping is achieved by quick change-outs of digital image, recipe and print head assembly thereby substantially shortening time-to-market and significantly reducing risk in volume ramp-up.
NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute was formed in 2015, by the Department of Defense (DoD) and FlexTech Alliance to advance manufacturing of FHE in the US. As part of its mission, NextFlex is issuing project awards for promising applications that focus on establishing capability in critical gap areas for flexible hybrid electronics manufacturing. This clearly demonstrates the continued confidence of industry leaders in the widespread adoption of FHE and helps transform FHE into a commercially viable industry. The field of flexible electronics is very promising, and the development of hybrid manufacturing capabilities that include printing and traditional silicon-based electronics is seen as a strong option going forward.
For more information visit our booth 3013 at the upcoming FLEX Conference (June 19-22, 2017) in Monterey, CA (USA) where Meyer Burger is going to present the latest developments in CONx systems as well as technology and applications specific to FHE.
About Meyer Burger Technology Ltd
Meyer Burger is a leading global technology company specialising on innovative systems and processes based on semiconductor technologies. The company’s focus is on photovoltaics (solar industry) while its competencies and technologies also cover important areas of the semiconductor and the optoelectronic industries as well as other selected high-end markets based on semiconductor materials. Over the past ten years, Meyer Burger has risen to the forefront of the photovoltaic market and established itself as an international premium brand by offering superior precision products and innovative technologies.
Meyer Burger’s offering in systems, production equipment and services along the photovoltaic value chain includes the manufacturing processes for wafers, solar cells, solar modules and solar systems. Meyer Burger provides substantial added value to its customers and clearly differentiates itself from its competitors by focusing on the entire value chain.
The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. The company is also working intensively to develop new markets such as South America, Africa and the Arab region. The registered shares of Meyer Burger Technology Ltd are listed on the SIX Swiss Exchange.
About Flexible Hybrid Electronics FHE gives everyday products the power of silicon ICs by combining them with new and unique printing processes and new materials. The result: lightweight, low-cost, flexible, conformable, stretchable, and highly efficient smart products with innumerable uses for consumer, commercial and military applications.
About NextFlex
NextFle, America’s Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network. Formed through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, nonprofits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex®'s elite team of thought leaders, educators, problem solvers and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems.
Suggested Items
AIM Solder Appoints Kevin Kwan as Business Development Manager in Asia
09/06/2024 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the appointment of Kevin Kwan as Business Development Manager for the Asian market.
SEMICON India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends
09/06/2024 | SEMISEMICON India 2024 will bring together global leaders, semiconductor industry experts, academia, and government officials from September 11-13, 2024, at the India Exposition Mart Ltd. (IEML) in Greater Noida, Delhi NCR.
MICRONOX MX2123 to Lead KYZEN Offerings at The International Symposium on Microelectronics
09/05/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor.
Altus Enhances Customer Support in the North
09/05/2024 | Altus GroupAltus Group, a leading capital equipment distributor for the electronics industry in the UK and Ireland, is pleased to announce the addition of a Senior Sales Manager to its growing team.
Altium, Mouser Team Up to Advance Electronics Education and Careers Worldwide
09/05/2024 | AltiumAltium LLC, a global leader in software and solutions for the electronics industry, and Mouser Electronics, a global authorized distributor of semiconductors and electronic components, are excited to announce a strategic partnership aimed at advancing electronics education and careers worldwide.