-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Summit Interconnect Orange Chooses atg A7a for High-speed Electrical Test and Automation
July 31, 2017 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute

Summit Interconnect has installed an atg A7a, an eight-head, double-sided, high-speed auto-load/unload system that provides true “lights-out” operation, at its Orange, California facility.
"The atg A7a will be our highest-speed tester yet, and with the auto-load/unload feature, it will significantly improve productivity on large jobs," said Summit Orange VP and General Manager Jack Evans.
The atg A7a auto-load/unload testers utilize eight flying probe test heads, multiple optical recognition systems, and a wide variety of advanced, high-speed electrical test measurement techniques to electrically test all types of PCBs for continuity and isolation. Board sizes of 24” x 21" or larger with small pad/fine-pitch technology can be tested quickly and easily. Special options, such as, 4-wire Kelvin tests, hi-pot test, latent defect test, and others can be provided.
About Summit Interconnect
Summit Interconnect is a manufacturer of advanced technology custom circuit boards with a specific focus on complex rigid and rigid-flex product with unique expertise in RF/Microwave applications. Manufacturing services include quick-turn, prototype and production through our two facilities located in Orange County, California.
About atg Luther & Maelzer GmbH
With more than 150 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the Printed Circuit Board industry. We have solutions for every application regardless of product type, batch size or technology deployed. Our atg flying probe tester products are renowned for Automation, speed, accuracy, versatility and ease of use, while the Luther & Maelzer universal grid tester product range is known worldwide for high throughput, repeatability, gentle handling and precision accuracy.
Suggested Items
Incap Helps Develop Future Talent in Robotics and Engineering in Finland
05/21/2025 | IncapIncap Corporation continues to invest in the next generation of technology professionals in Finland through its involvement in two national initiatives focused on technical and vocational education.
Jabil, AVL Collaborate on Design and Manufacturing Solutions for Automotive and Transportation Customers
05/21/2025 | BUSINESS WIREJabil Inc., a global manufacturing solutions provider to market-leading automakers, announced it has signed a memorandum of understanding (MOU) with AVL Software and Functions GmbH, the e-drive and software center of AVL List GmbH.
Altus, Danutek Expand Partnership with LPKF to Offer Laser Plastic Welding Solutions
05/21/2025 | Altus GroupAltus Group, a leading supplier of capital equipment and service support for the electronics manufacturing sector in the UK and Ireland, and its sister company Danutek, which serves Central and Eastern Europe, are expanding their technology offering through an enhanced partnership with LPKF, a specialist in laser-based manufacturing solutions.
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca TechnologiesDeca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.