Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Flexible Hybrid Electronics & Sensors Impacting the Automotive Industry
September 1, 2017 | SEMIEstimated reading time: 1 minute
FlexTech, a SEMI strategic association partner, will host a one-day forum: Flexible Hybrid Electronics and Sensors in the Automotive Industry in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.
The forum will break down the topic into four key areas: OEM applications; market analysis and forecasts; challenges to integration; and solutions for Tier 2 and Tier 3 suppliers. Speakers include representatives from SBD Automotive, Fiat-Chrysler Group LLC, Velodyne LiDAR, Lumitex, Alpha Micron, NextFlex, Auburn University, Universal Instruments, Interlink Electronics, Georgia Institute of Technology, DuPont Photovoltaics & Advanced Materials and more.
“This forum is an excellent opportunity to discover the possibilities of flexible electronic systems incorporating advance semiconductors, MEMS, and sensors, will provide lightweight, sensor networks that conform, curve, and possibly more. New automotive applications in this area will enable wholly new approaches for the in-cabin driving experience,” said Dr. Melissa Grupen-Shemansky, CTO for Flexible Electronics & Advanced Packaging at SEMI | FlexTech.
Company tours to Ford and a networking dinner are scheduled for September 12, 2017. For more information on the forum and how to register, visit the event website at: semi/org/en/FHE-forum-summary.
About SEMI & FlexTech SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
09/16/2025 | Jesse Vaughan -- Column: Beyond the BoardThe MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.