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EU Commission Launches Stakeholder Consultation on RoHS ExemptionsSeptember 20, 2017 | IPC
Estimated reading time: 1 minute
The European Union (EU) Commission launched a four-week stakeholder consultation on DRAFT Delegated Directives for exemptions:
- 6(a) Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight
- 6(b) Lead as an alloying element in aluminum containing up to 0.4% lead by weight
- 6(c) Copper alloy containing up to 4% lead by weight
- 7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
- 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound
- 18(b) Lead as activator in the fluorescent power of discharge lamps containing phosphors
- 24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
- 34 Lead in cermet-based trimmer potentiometer elements
The consultation closes on October 17, 2017.
IPC, in conjunction with an international industry stakeholder group, applied for more than a dozen exemption extension requests under the EU RoHS Directive. The RoHS2 Directive dictates expiration dates for all exemptions granted and several critical to the electronics manufacturing industry were set to expire by July 21, 2016. However, all exemptions for which industry submitted a renewal application will not expire until the EU Commission completes the current ongoing review of the applications.
Throughout the process, IPC and several member companies provided important technical information in order to ensure the extension requests are robust and scientifically sound. IPC reviewed all extension requests and provided important feedback that resulted in credible material submitted to the EU Commission.
IPC’s EHS Committee and RoHS Exemptions Task Force will review the draft delegated acts and develop a response to the stakeholder consultation. IPC member companies are also encouraged to comment directly to EU Commission through their website.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.