-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
AISMALIBAR to Present FASTHERM at Ford Advanced Lighting Innovation Expo 2017
September 25, 2017 | AismalibarEstimated reading time: 1 minute
Aismalibar is set to introduce their newest product offering, FASTHERM, at the Ford Advanced Lighting Innovation Expo (ALIE) show in Dearborn, MI on October 3-4, 2017.
FASTHERM was developed by AISMALIBAR to achieve a faster thermal transition from the LED thermal pad to the heat sink. This technology allows LEDs to operate at a temperature 30°C to 50°C lower due to the direct thermal transition from the thermal pad to the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper/aluminium base.
Jeff Brandman, President of Aismalibar North America, remarks, “We’re very excited to continue to work with FORD in automotive lighting product development. It is exciting to introduce FASTHERM at such a specialized event and we look forward to presenting our technical capabilities to all stakeholders at the expo.”
ALIE is a unique, ground-breaking opportunity to network with top global OEMS, manufacturers, engineers, buyers and designers directly involved in new and innovative automotive lighting technology.
Aismalibar is a global leader for insulated metal substrates used in the manufacturing of automotive lighting. With strong relationships with many TIER 1 suppliers their products can be found in lighting for many vehicles manufactured around the world and are in current generation Ford, Mercedes, Audi and BMW vehicles among others.
About Aismalibar
AISMALIBAR was one of the first IMS laminate manufacturers in the world and was the first in Europe. AISMALIBAR is proud to introduce their material to the North American market in 2012. Their product IMS Cobritherm ® is a qualified and recognized Insulated Metal Substrate which gives the best thermal management solutions with high thermal conductivity, low thermal impedance and high dielectric capacity. AISMALIBAR has implement a 100% proof test with 1-3KV (High Pot Test) to all IMS laminates coming out of their plant. This is the only way to insure the dialectical strength is perfect and that production problems are detected before PCBs arrive to the end user.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
01/20/2026 | PRNewswireAs computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
TÜV Rheinland Advances Electronics Supply Chain Traceability
01/13/2026 | BUSINESS WIREWith electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.
Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
12/29/2025 | ElephantechJapanese deep-tech Elephantech announced successful development of an innovative process to form High-Density Interconnect (HDI) microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”
TopLine Introduces Cost-Efficient Flip Chips with Daisy Chain for Electrical Test Learning
12/23/2025 | TopLine CorporationFlip Chips with Daisy Chain from TopLine Corporation are a cost-efficient way to learn electrical test for engineers seeking to understand and practice necessary techniques for working with Flip Chip components.
Elephantech Launches Copper-on-Copper Self-Assembled Nanoparticles
12/22/2025 | ElephantechJapanese deep-tech startup Elephantech Inc. announced the successful development of Self-Assembled Copper Nanoparticles (SA-CuNP), a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.