-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
HDI’s Beneficial Influence on High-Frequency Signal Integrity
October 17, 2017 | Happy Holden, I-Connect007Estimated reading time: 1 minute

Introducing the Benefits of Microvias
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs). In addition, extremely fast clock speeds and high signal bandwidths challenge systems designers to find better ways to overcome the negative effects of noise, radio frequency interference (RFI) and electro-magnetic interference (EMI) have on their product’s performance. Finally, increasingly restrictive cost targets are compounding problems associated with today’s smaller, denser, lighter, and faster systems.
Staying competitive and delivering the products people want means seeking out and embracing the best available technologies and design methodologies. The use of PCBs incorporating microvia circuit interconnects is currently one of the most viable solutions on the market (Figure 1). Adopting microvia technology means that products can use the newest, smallest, and fastest devices, meet stringent RFI/ EMI requirements, and keep pace with downward-spiraling cost targets.
What are Microvia Technologies?
Microvias are vias of 6-mils (150 microns) diameter or less. Their most typical use today is in blind and buried vias used to create interconnections through one dielectric layer within a PCB. Microvias are commonly used in blind via constructions where the outer layers of a multilayer PCB are connected to the next adjacent signal layer. Used in all forms of electronic products, they effectively allow for the cost effective fabrication of high-density assemblies.
The IPC has selected high-density interconnection structures (HDIS) as the term to refer to these various microvia technologies. This definition is by no means universal. The Japanese refer to any via drilled by lasers in a thin dielectric as a microvia.
To read the full version of this article which appeared in the October 2017 issue of The PCB Magazine, click here.
Suggested Items
Hunting for Clues: Feng Xue Solving Circuit Board 'Crimes' With AOI Standard
05/08/2025 | Linda Stepanich, IPCWhen residents in sleepy English villages needed a top-tier detective to solve a murder, they called on Belgian super-sleuth Hercule Poirot, author Agatha Christie’s fictional detective famous for using his “little grey cells” to solve crimes. In the same way, IPC standards development committees, when creating a standard to detect defects in circuit boards using Automated Optical Inspection (AOI), call on IPC A-Team, Hercule.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
05/06/2025 | Chris Mitchell -- Column: The Government CircuitThere is certainly no shortage of work to be done in the IPC Government Relations department, as the U.S. waged a tariff campaign on practically every industrial country in the world and several countries embarked on high-tech initiatives with a mix of approaches to the crucial foundations of electronics manufacturing. Indeed, the breadth and speed of U.S. President Donald Trump’s tariff campaign continues to be a serious challenge for our industry.